Abstract
A new probing technique has been developed to test thin film mechanical properties. In the Microwedge Scratch Test (MWST), a wedge shaped diamond indenter tip is drawn along a fine line, while simultaneously being driven into the line. We compare microwedge scratching of Zone 1 and Zone T thin film specimens of sputtered W on SiO2. Symptomatic of its poor mechanical properties, the Zone 1 film displays three separate crack systems. Because of its superior grain boundary strength, the Zone T film displayed only one of these - an interfacial crack system. Using bimaterial linear elastic fracture mechanics, governing equations are developed for propagating interfacial cracks, including expressions for strain energy release rate, bending strain, and mode mixity. Grain boundary fracture strength information may be deduced from the Zone 1 films, while adhesion may be inferred from the Zone T films.
| Original language | English (US) |
|---|---|
| Title of host publication | Thin Films |
| Subtitle of host publication | Stresses and Mechanical Properties VI |
| Editors | W.W. Gerberich, H. Gao, J.E. Sundgren, S.P. Baker |
| Volume | 436 |
| State | Published - Dec 1 1996 |
| Event | Proceedings of the 1996 MRS Spring Meeting - San Francisco, CA, USA Duration: Apr 8 1996 → Apr 11 1996 |
Other
| Other | Proceedings of the 1996 MRS Spring Meeting |
|---|---|
| City | San Francisco, CA, USA |
| Period | 4/8/96 → 4/11/96 |