@inproceedings{e4bcd82fbb8d48c9a8ebec7d9fd6e5e7,
title = "Measurement, analysis and improvement of supply noise in 3D ICs",
abstract = "Supply noise measurements from a 3D IC have been presented for the first time. IR noise rather than Ldi/dt noise is shown to be dominant due to the fewer supply pins and the additional resistance from the through-silicon vias (TSVs). Kelvin probing for IR noise reveals that the effect of pins is significantly more than TSVs. A novel multi-story power delivery is demonstrated for a 393kb SRAM suppressing the IR noise by 30-70%.",
author = "Pulkit Jain and Dong Jiao and Xiaofei Wang and Kim, {Chris H.}",
year = "2011",
language = "English (US)",
isbn = "9784863481657",
series = "IEEE Symposium on VLSI Circuits, Digest of Technical Papers",
pages = "46--47",
booktitle = "2011 Symposium on VLSI Circuits, VLSIC 2011 - Digest of Technical Papers",
note = "2011 Symposium on VLSI Circuits, VLSIC 2011 ; Conference date: 15-06-2011 Through 17-06-2011",
}