MEASURED AND CALCULATED STRESSES IN Cr//2O//3 SCALES AND THEIR Cr SUBSTRATES.

J. H. Stout, W. W. Gerberich, S. Lin, M. Lii

Research output: Contribution to journalConference articlepeer-review

Abstract

The development of growth stresses, thermal stresses and resultant residual stresses are analyzed by combining the results of x-ray diffraction measurements and a finite element method that models the distribution of those stresses. The observed normal component of residual stress in Cr//2O//3 grown on Cr at 900 degree C is compressive. The normal stresses in the coarser-grained substrate are also compressive, from which tensional in-plane stresses are calculated. The finite element analysis predicts the in-plane compressional stresses of the oxide in equilibrium with a substrate in tension. Comparison of these results with calculated thermal stresses indicates that a significant component of compressional growth stress has contributed to the observed residual stresses.

Original languageEnglish (US)
Pages (from-to)173-186
Number of pages14
JournalProceedings - The Electrochemical Society
Volume86-9
StatePublished - Dec 1 1986

Fingerprint Dive into the research topics of 'MEASURED AND CALCULATED STRESSES IN Cr//2O//3 SCALES AND THEIR Cr SUBSTRATES.'. Together they form a unique fingerprint.

Cite this