TY - GEN
T1 - Launderability of surface-insulated cut and sew E-textiles
AU - Molla, Md Tahmidul Islam
AU - Compton, Crystal
AU - Dunne, Lucy E.
PY - 2018/10/8
Y1 - 2018/10/8
N2 - E-textiles that enable distribution of electronic components have advantages for wearable technology, in that functionality, power, and networking can be spread over a much larger area while preserving hand-feel and wearability. However, textile-embedded circuitry often must be machine-washable to conform to user expectations for care and maintenance, particularly for garments. In this study, we evaluate the robustness to home laundering of a previously-developed cut-and-sew technique for assembling e-textile circuits. Alternative surface insulation materials, textile substrate properties, and soldered component joints are evaluated. After around 1000 minutes (16.67 hours) of rigorous washing and drying, we measured a best-case 0% failure rate for component solder joints, and a best-case 0.38 ohm/m maximum increase in trace resistance. Liquid silicone seam sealer was effective in protecting 100% of solder joints. Two tape-type alternative surface insulation materials were effective in protecting bare traces and component attachment points respectively. Overall, results demonstrate the feasibility of producing insulated, washable cut-and-sew circuits for smart garment manufacturing.
AB - E-textiles that enable distribution of electronic components have advantages for wearable technology, in that functionality, power, and networking can be spread over a much larger area while preserving hand-feel and wearability. However, textile-embedded circuitry often must be machine-washable to conform to user expectations for care and maintenance, particularly for garments. In this study, we evaluate the robustness to home laundering of a previously-developed cut-and-sew technique for assembling e-textile circuits. Alternative surface insulation materials, textile substrate properties, and soldered component joints are evaluated. After around 1000 minutes (16.67 hours) of rigorous washing and drying, we measured a best-case 0% failure rate for component solder joints, and a best-case 0.38 ohm/m maximum increase in trace resistance. Liquid silicone seam sealer was effective in protecting 100% of solder joints. Two tape-type alternative surface insulation materials were effective in protecting bare traces and component attachment points respectively. Overall, results demonstrate the feasibility of producing insulated, washable cut-and-sew circuits for smart garment manufacturing.
KW - Durability.
KW - E-textiles
KW - Embedded electronics
KW - Encapsulation
KW - Launderability
KW - Wearable technology
UR - http://www.scopus.com/inward/record.url?scp=85056908402&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85056908402&partnerID=8YFLogxK
U2 - 10.1145/3267242.3267255
DO - 10.1145/3267242.3267255
M3 - Conference contribution
AN - SCOPUS:85056908402
T3 - Proceedings - International Symposium on Wearable Computers, ISWC
SP - 104
EP - 111
BT - ISWC 2018 - Proceedings of the 2018 ACM International Symposium on Wearable Computers
PB - Association for Computing Machinery
T2 - 22nd International Symposium on Wearable Computers, ISWC 2018
Y2 - 8 October 2018 through 12 October 2018
ER -