Laterally-scaled Si/SiGe n-MODFETs with in situ and ion-implanted p-well doping

  • S. J. Koester
  • , K. L. Saenger
  • , J. O. Chu
  • , Q. C. Ouyang
  • , J. A. Ott
  • , D. F. Canaperi
  • , J. A. Tornello
  • , C. V. Jahnes
  • , S. E. Steen

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Scopus citations

Abstract

The operation of laterally-scaled Silicon (Si)/SiGe n-MODFETs with buried in situ and ion-impanted p-well doping was investigated. The layer stuctures were grown by UHV-chemical vapor deposition (CVD) on 8 inch Si wafers and consisted of a Si 0.7Ge 0.3 bottom barrier layer, a Si quantum well, a top undoped Si 0.7Ge 0.3 spacer layer and a Si cap layer. MODFETs utilizing implanted p-wells were characterized using dc I-V measurements at room temperature. Results show that the devices have improved subthreshold behavior, greatly improved self-gain and improved speed-power product compared with undoped controls.

Original languageEnglish (US)
Title of host publicationDevice Research Conference - Conference Digest, 62nd DRC
Pages107-108
Number of pages2
DOIs
StatePublished - Dec 1 2004
EventDevice Research Conference - Conference Digest, 62nd DRC - Notre Dame, IN, United States
Duration: Jun 21 2004Jun 23 2004

Publication series

NameDevice Research Conference - Conference Digest, DRC
ISSN (Print)1548-3770

Other

OtherDevice Research Conference - Conference Digest, 62nd DRC
Country/TerritoryUnited States
CityNotre Dame, IN
Period6/21/046/23/04

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