Abstract
In this study, we report results on a piezoelectric-material-based mechanical energy-harvesting device that was fabricated by combining laser machining with microelectronics packaging technology. It was found that the laser-machining process did not have significant effect on the electrical properties of piezoelectric material. The fabricated device was tested in the low-frequency regime of 50 to 1000 Hz at constant force of 8 g (where g = 9.8m/s2). The device was found to generate continuous power of 1.13 μW at 870 Hz across a 288.5 kΩ load with a power density of 301.3 μW/cm3.
Original language | English (US) |
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Article number | 4626918 |
Pages (from-to) | 1900-1905 |
Number of pages | 6 |
Journal | IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control |
Volume | 55 |
Issue number | 9 |
DOIs | |
State | Published - Sep 2008 |
Externally published | Yes |
Bibliographical note
Funding Information:Manuscript received January 9, 2007; accepted April 6, 2008. The authors gratefully acknowledge the support of Texas Advanced Research Program. H. Kim, V. Bedekar, and R. A. Islam are with Materials Science and Engineering, University of Texas, Arlington, TX. W.-H. Lee is with the Automation & Robotics Research Institute, Fort Worth, TX. D. Leo and S. Priya are with the Center for Intelligent Material Systems and Structures (CIMSS), Mechanical Engineering, Virginia Tech, Blacksburg, VA (e-mail: [email protected]). Digital Object Identifier 10.1109/TUFFC.881