Interfacial effect on the ferromagnetic damping of CoFeB thin films with different under-layers

Shaohai Chen; Minghong Tang; Zongzhi Zhang; B. Ma; S. T. Lou; Q. Y. Jin

doi:10.1063/1.4813763

Interfacial effect on the ferromagnetic damping of CoFeB thin films with different under-layers

Shaohai Chen, Minghong Tang, Zongzhi Zhang, B. Ma, S. T. Lou, Q. Y. Jin

Electrical and Computer Engineering

Research output: Contribution to journal › Article › peer-review

26 Scopus citations

Abstract

Interfacial effects on magnetic properties are investigated for the as-deposited and annealed Co₆₄Fe₁₆B₂₀ films with different under-layers (Cu, Ru, or Pd). The intrinsic Gilbert damping factor is inferred to be slightly lower than the obtained value of 0.007. We found that both the in-plane coercivity H_c and ferromagnetic resonance linewidth ΔH_pp rely on the interfacial morphology. The Cu under-layer provides a rough surface, which offers an extra contribution to the ΔH_pp. The surface roughness was greatly enhanced by post-annealing for Cu, while little affected for Ru and Pd. Resultingly, the ΔH_pp and H_c of Cu/CoFeB increase significantly after annealing. However, for the annealed Ru/CoFeB sample, the ΔH_pp even decreases implying Ru is a proper under-layer material for CoFeB-based spintronic devices.

Original language	English (US)
Article number	032402
Journal	Applied Physics Letters
Volume	103
Issue number	3
DOIs	https://doi.org/10.1063/1.4813763
State	Published - Jul 15 2013

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@article{cbeb884497de4813b20ce562452c7b5e,

title = "Interfacial effect on the ferromagnetic damping of CoFeB thin films with different under-layers",

abstract = "Interfacial effects on magnetic properties are investigated for the as-deposited and annealed Co64Fe16B20 films with different under-layers (Cu, Ru, or Pd). The intrinsic Gilbert damping factor is inferred to be slightly lower than the obtained value of 0.007. We found that both the in-plane coercivity Hc and ferromagnetic resonance linewidth ΔHpp rely on the interfacial morphology. The Cu under-layer provides a rough surface, which offers an extra contribution to the ΔHpp. The surface roughness was greatly enhanced by post-annealing for Cu, while little affected for Ru and Pd. Resultingly, the ΔHpp and Hc of Cu/CoFeB increase significantly after annealing. However, for the annealed Ru/CoFeB sample, the ΔHpp even decreases implying Ru is a proper under-layer material for CoFeB-based spintronic devices.",

author = "Shaohai Chen and Minghong Tang and Zongzhi Zhang and B. Ma and Lou, {S. T.} and Jin, {Q. Y.}",

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T1 - Interfacial effect on the ferromagnetic damping of CoFeB thin films with different under-layers

AU - Chen, Shaohai

AU - Tang, Minghong

AU - Zhang, Zongzhi

AU - Ma, B.

AU - Lou, S. T.

AU - Jin, Q. Y.

PY - 2013/7/15

Y1 - 2013/7/15

N2 - Interfacial effects on magnetic properties are investigated for the as-deposited and annealed Co64Fe16B20 films with different under-layers (Cu, Ru, or Pd). The intrinsic Gilbert damping factor is inferred to be slightly lower than the obtained value of 0.007. We found that both the in-plane coercivity Hc and ferromagnetic resonance linewidth ΔHpp rely on the interfacial morphology. The Cu under-layer provides a rough surface, which offers an extra contribution to the ΔHpp. The surface roughness was greatly enhanced by post-annealing for Cu, while little affected for Ru and Pd. Resultingly, the ΔHpp and Hc of Cu/CoFeB increase significantly after annealing. However, for the annealed Ru/CoFeB sample, the ΔHpp even decreases implying Ru is a proper under-layer material for CoFeB-based spintronic devices.

AB - Interfacial effects on magnetic properties are investigated for the as-deposited and annealed Co64Fe16B20 films with different under-layers (Cu, Ru, or Pd). The intrinsic Gilbert damping factor is inferred to be slightly lower than the obtained value of 0.007. We found that both the in-plane coercivity Hc and ferromagnetic resonance linewidth ΔHpp rely on the interfacial morphology. The Cu under-layer provides a rough surface, which offers an extra contribution to the ΔHpp. The surface roughness was greatly enhanced by post-annealing for Cu, while little affected for Ru and Pd. Resultingly, the ΔHpp and Hc of Cu/CoFeB increase significantly after annealing. However, for the annealed Ru/CoFeB sample, the ΔHpp even decreases implying Ru is a proper under-layer material for CoFeB-based spintronic devices.

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