Interface roughness effects on adhesion of Ta2N films

N. R. Moody, S. Venkataraman, J. Nelson, W. Worobey, W. W. Gerberich

Research output: Contribution to journalConference articlepeer-review

4 Scopus citations


In this study, we employed continuous microscratch testing to determine the effects of interface roughness on adhesion and fracture toughness of thin Ta2N films. These films were sputter-deposited on single crystal sapphire and polycrystal alumina substrates to a thickness of 0.5 μm. Comparison of the results showed that the interfacial fracture energy increased from 0.4 J/m2 for films on the single crystals to 1.5 J/m2 for films on the polycrystals with a corresponding increase in fracture toughness values. These results are consistent with crack deflection and interface roughness models and are useful for understanding adhesion and toughness on the submicron scale. The results also show that the continuous microscratch technique is a viable approach to determining adhesion and toughness of bi-material systems.

Original languageEnglish (US)
Pages (from-to)337-342
Number of pages6
JournalMaterials Research Society Symposium - Proceedings
StatePublished - 1994
EventProceedings of the 1993 Fall Meeting of the Materials Research Society - Boston, MA, USA
Duration: Nov 29 1993Dec 2 1993


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