Interface-facilitated deformation twinning in copper within submicron Ag-Cu multilayered composites

Jian Wang, Irene J. Beyerlein, Nathan A. Mara, Dhriti Bhattacharyya

Research output: Contribution to journalArticlepeer-review

75 Scopus citations

Abstract

Rolling of Ag-Cu layered eutectic composites with bilayer thicknesses in the submicron regime (∼200-400 nm) activated deformation twinning in Cu. Using atomistic simulations and dislocation theory, we propose that the Ag-Cu interface facilitated deformation twinning in Cu by permitting the transmission of twinning partials from Ag to Cu. In this way, twins in Ag can provide an ample supply of twinning partials to Cu to support and sustain twin growth in Cu during deformation. Interface-driven twinning as revealed by this study suggests the exciting possibility of altering the roles of dislocation slip and twinning through the design of heterophase interface structure and properties.

Original languageEnglish (US)
Pages (from-to)1083-1086
Number of pages4
JournalScripta Materialia
Volume64
Issue number12
DOIs
StatePublished - Jun 2011

Bibliographical note

Funding Information:
This work was supported as part of the Center for Materials at Irradiation and Mechanical Extremes, an Energy Frontier Research Center funded by the US Department of Energy , Office of Science, Office of Basic Energy Sciences under Award Number 2008LANL1026. J.W. and D.B. also acknowledge support provided by the Los Alamos National Laboratory Directed Research and Development (LDRD) project DR20110029.

Keywords

  • Cu
  • Interfaces
  • Multilayers
  • Twinning

Fingerprint

Dive into the research topics of 'Interface-facilitated deformation twinning in copper within submicron Ag-Cu multilayered composites'. Together they form a unique fingerprint.

Cite this