Abstract
In-memory computing (IMC) provides a dense and parallel structure for high performance and energy-efficient acceleration of deep neural networks (DNNs). The increased computational density of IMC architectures results in increased on -chip communication costs, stressing the interconnect fabric. In this work, we develop a novel performance benchmark tool for IMC architectures that incorporates device, circuits, architecture, and interconnect under a single roof. The tool assesses the area, energy, and latency of the IMC accelerator. We analyze three interconnect cases to illustrate the versatility of the tool: (1) Point-to-point (P2P) and network-on-chip (NoC) based IMC architectures to demonstrate the criticality of the interconnect choice; (2) Area and energy optimization to improve IMC utilization and reduce on-chip interconnect cost; (3) Evaluation of a reconfigurable NoC to achieve minimum on-chip communication latency. Through these studies, we motivate the need for future work in the design of optimal on-chip and off-chip interconnect fabrics for IMC architectures.
Original language | English (US) |
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Title of host publication | China Semiconductor Technology International Conference 2021, CSTIC 2021 |
Editors | Cor Claeys, Steve X. Liang, Qinghuang Lin, Ru Huang, Hanming Wu, Peilin Song, Linyong Pang, Ying Zhang, Beichao Zhang, Xinping Xinping Qu, Cheng Zhuo, Hsiang-Lan Lung |
Publisher | Institute of Electrical and Electronics Engineers Inc. |
ISBN (Electronic) | 9781665449458 |
DOIs | |
State | Published - Mar 14 2021 |
Externally published | Yes |
Event | 2021 China Semiconductor Technology International Conference, CSTIC 2021 - Shanghai, China Duration: Mar 14 2021 → Mar 15 2021 |
Publication series
Name | China Semiconductor Technology International Conference 2021, CSTIC 2021 |
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Conference
Conference | 2021 China Semiconductor Technology International Conference, CSTIC 2021 |
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Country/Territory | China |
City | Shanghai |
Period | 3/14/21 → 3/15/21 |
Bibliographical note
Publisher Copyright:© 2021 IEEE.