Abstract
As pultrusion continues to gain interest in the materials industry, a process model to predict resin cure and temperature becomes more important. Since the pultrusion manufacturer often does not have large-scale computing power available, the scope of this paper is to develop a simplified pultrusion analysis for microcomputers. The result of this work is an integrated analysis package for curing characterization and pultrusion analysis. The program may be operated on microcomputers. Together with other process monitoring techniques, the analysis will help the manufacturer make decisions on line speeds, resin formulations, and operating conditions.
| Original language | English (US) |
|---|---|
| Title of host publication | Society of the Plastics Industry, Reinforced Plastics/Composites Institute, Annual Conference - Proceedings |
| Publisher | Publ by SPI |
| State | Published - Feb 1 1988 |
| Event | Proceedings - Technical Sessions of the 43rd Annual Conference, Composites Institute - Cincinnati, OH, USA Duration: Feb 1 1988 → Feb 5 1988 |
Other
| Other | Proceedings - Technical Sessions of the 43rd Annual Conference, Composites Institute |
|---|---|
| City | Cincinnati, OH, USA |
| Period | 2/1/88 → 2/5/88 |