Influence of deposition conditions on mechanical properties of low-pressure chemical vapor deposited low-stress silicon nitride films

Yvete Toivola, Jeremy Thurn, Robert F. Cook, Greg Cibuzar, Kevin Roberts

Research output: Contribution to journalArticle

56 Scopus citations

Abstract

Low-pressure chemical vapor deposited silicon nitride films were deposited with room temperature deposition stresses. The effect of deposition pressure, input gas ratio, and deposition temperature was evaluated. Film biaxial modulus, hardness, thermal expansion, and plane strain modulus were independent of room temperature deposition stress. Film density and refractive index were sensitive to the changes in the deposition conditions and room temperature deposition stress was altered by the changes.

Original languageEnglish (US)
Pages (from-to)6915-6922
Number of pages8
JournalJournal of Applied Physics
Volume94
Issue number10
DOIs
StatePublished - Nov 15 2003

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