Influence of chip/encapsulant delamination on the thermo-structural behavior of a thermally-pulsed plastic IC package

Devin E. Mix, Avram Bar-Cohen, Kumar K. Tamma

Research output: Contribution to conferencePaper

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Abstract

Finite element (FE) modeling was employed to investigate the thermo-structural response of a thermally-pulsed plastic IC package. The complex spatial and temporal thermo-structural behavior was examined for two cases. In the first case perfect adhesion was assumed at the various interfaces throughout the package. In the second case thermal contact resistance and structural slip conditions were modelled at the interface between the top surface of the chip and encapsulant while perfect adhesion was maintained at all other interfaces. Since three-dimensional modeling is computationally expensive and cumbersome, attention is focused on axisymmetric models that provide fairly accurate representations of the representative situations and enable improved predictions for the thermal fields and subsequently the associated thermo-structural behavior.

Original languageEnglish (US)
Pages55-79
Number of pages25
StatePublished - Dec 1 1993
EventProceedings of the 1993 ASME International Electronics Packaging Conference - Binghamton, NY, USA
Duration: Sep 29 1993Oct 2 1993

Other

OtherProceedings of the 1993 ASME International Electronics Packaging Conference
CityBinghamton, NY, USA
Period9/29/9310/2/93

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Mix, D. E., Bar-Cohen, A., & Tamma, K. K. (1993). Influence of chip/encapsulant delamination on the thermo-structural behavior of a thermally-pulsed plastic IC package. 55-79. Paper presented at Proceedings of the 1993 ASME International Electronics Packaging Conference, Binghamton, NY, USA, .