Modern power grids use via arrays to connect wires across metal layers. These arrays are susceptible to electromigration (EM), which creates voids under the vias, potentially causing circuit malfunction. We combine the effect of via redundancy with models that characterize the effect of via array geometry on thermomechanical stress, and determine how the choice of via arrays can affect EM-induced failure in a power grid based on IR-drop threshold based failure criteria.
|Original language||English (US)|
|Title of host publication||Proceedings of the 54th Annual Design Automation Conference 2017, DAC 2017|
|Publisher||Institute of Electrical and Electronics Engineers Inc.|
|State||Published - Jun 18 2017|
|Event||54th Annual Design Automation Conference, DAC 2017 - Austin, United States|
Duration: Jun 18 2017 → Jun 22 2017
|Name||Proceedings - Design Automation Conference|
|Other||54th Annual Design Automation Conference, DAC 2017|
|Period||6/18/17 → 6/22/17|
Bibliographical noteFunding Information:
This work was partially supported by the NSF awards CCF-1421606, CCF-1162267, and the Doctoral Dissertation Fellowship, University of Minnesota.
© 2017 ACM.
- IR drop
- power grid
- thermomechanical stress
- via array