TY - GEN
T1 - Improving nanoelectronic designs using a statistical approach to identify key parameters in circuit level SEU simulations
AU - Ness, Drew C.
AU - Hescott, Christian J.
AU - Lilja, David J
PY - 2007/1/1
Y1 - 2007/1/1
N2 - One of the key challenges in nanoelectronics design is the decreasing reliability due to radiation induced single-event upsets. Without detailed device level simulations or physical experimentation, circuit level models can generate misleading reliability information. We present the results from a screening experiment to identify significant parameters in circuit level SEU simulations. We show that cell supply voltage, sizing parameters, and transient waveform descriptions have an important impact on design and should therefore be considered with care in circuit level designs. Larger variations in parameters can lead to soft error rate estimates that vary by more than 4 orders of magnitude, even small variations can lead to 15x variation in soft error rate estimation for a design. We present our methodology for screening and a ranking based on significance of several parameters involved in soft error simulation at the SPICE level.
AB - One of the key challenges in nanoelectronics design is the decreasing reliability due to radiation induced single-event upsets. Without detailed device level simulations or physical experimentation, circuit level models can generate misleading reliability information. We present the results from a screening experiment to identify significant parameters in circuit level SEU simulations. We show that cell supply voltage, sizing parameters, and transient waveform descriptions have an important impact on design and should therefore be considered with care in circuit level designs. Larger variations in parameters can lead to soft error rate estimates that vary by more than 4 orders of magnitude, even small variations can lead to 15x variation in soft error rate estimation for a design. We present our methodology for screening and a ranking based on significance of several parameters involved in soft error simulation at the SPICE level.
KW - Circuit level reliability
KW - Plackett and Burman design
KW - Single event upset (SEU)
KW - Soft-error rate (SER)
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U2 - 10.1109/NANOARCH.2007.4400857
DO - 10.1109/NANOARCH.2007.4400857
M3 - Conference contribution
AN - SCOPUS:50849141324
SN - 9781424417919
T3 - 2007 IEEE International Symposium on Nanoscale Architectures, NANOARCH
SP - 46
EP - 53
BT - 2007 IEEE International Symposium on Nanoscale Architectures, NANOARCH
PB - IEEE Computer Society
T2 - 2007 IEEE International Symposium on Nanoscale Architectures, NANOARCH
Y2 - 21 October 2007 through 22 October 2007
ER -