Impact of interconnect length on BTI and HCI induced frequency degradation

Xiaofei Wang, Pulkit Jain, Dong Jiao, Chris H. Kim

Research output: Chapter in Book/Report/Conference proceedingConference contribution

14 Scopus citations

Abstract

The dependence of Bias Temperature Instability (BTI) and Hot Carrier Injection (HCI) induced frequency degradation on interconnect length has been examined for the first time. Experimental data from 65nm test chips show that frequency degradation due to BTI decreases monotonically with longer wires because of the shorter effective stress time, while the HCI-induced component has a non-monotonic relationship with interconnect length due to the combined effect of increased effective stress time and decreased effective stress voltage. A simple aging model is proposed to capture the distinct BTI and HCI effects in global interconnect drivers.

Original languageEnglish (US)
Title of host publication2012 IEEE International Reliability Physics Symposium, IRPS 2012
Pages2F.5.1-2F.5.6
DOIs
StatePublished - Sep 28 2012
Event2012 IEEE International Reliability Physics Symposium, IRPS 2012 - Anaheim, CA, United States
Duration: Apr 15 2012Apr 19 2012

Publication series

NameIEEE International Reliability Physics Symposium Proceedings
ISSN (Print)1541-7026

Other

Other2012 IEEE International Reliability Physics Symposium, IRPS 2012
Country/TerritoryUnited States
CityAnaheim, CA
Period4/15/124/19/12

Keywords

  • Aging
  • bias temperature instability
  • degradation
  • hot carrier injection
  • interconnect

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