Highly efficient thermal glue for carbon nanotubes based on azide polymers

Yuxiang Ni, Hung Le Khanh, Yann Chalopin, Jinbo Bai, Pierre Lebarny, Laurent Divay, Sebastian Volz

Research output: Contribution to journalArticlepeer-review

35 Scopus citations


Equilibrium molecular dynamics (EMD) simulations and experimental data show that the thermal contact resistance (TCR) between carbon nanotube (CNT) and azide-functionalized polymer with C-N bond is significantly decreased compared to that with Van der Waals force interaction. EMD simulations indicate that C-N covalent bond between CNT and polymer is the most efficient way to reduce TCR, and we measured the lowest thermal interface resistance of Si/CNT/Polymer/Cu thermal interface material as 1.40 mm 2 KW -1 with CNTs of 10 μm length. These results provide useful information for future designs of thermal glue for carbon-based materials with better thermal conduction.

Original languageEnglish (US)
Article number193118
JournalApplied Physics Letters
Issue number19
StatePublished - May 7 2012
Externally publishedYes


Dive into the research topics of 'Highly efficient thermal glue for carbon nanotubes based on azide polymers'. Together they form a unique fingerprint.

Cite this