Abstract
Equilibrium molecular dynamics (EMD) simulations and experimental data show that the thermal contact resistance (TCR) between carbon nanotube (CNT) and azide-functionalized polymer with C-N bond is significantly decreased compared to that with Van der Waals force interaction. EMD simulations indicate that C-N covalent bond between CNT and polymer is the most efficient way to reduce TCR, and we measured the lowest thermal interface resistance of Si/CNT/Polymer/Cu thermal interface material as 1.40 mm 2 KW -1 with CNTs of 10 μm length. These results provide useful information for future designs of thermal glue for carbon-based materials with better thermal conduction.
Original language | English (US) |
---|---|
Article number | 193118 |
Journal | Applied Physics Letters |
Volume | 100 |
Issue number | 19 |
DOIs | |
State | Published - May 7 2012 |
Externally published | Yes |