High speed digital signal analysis of ultra-broadband micromachined flip-chip interconnect designs

Young Seek Cho, Rhonda Franklin Drayton

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

Multi-gigabits digital signal transmission in flip-chip interconnect is studied. It is indicated that a conventional flip-chip (CFC) interconnect has two distinct problems. Adding two micromachined features, air cavity and trenches, can improve the transmission characteristic of the CFC interconnect, which is called locally matched flip-chip (LMFC) interconnect. The measured S-parameters, which are the parameters in the frequency domain, show that the LMFC interconnect has the bandwidth of return loss below 20 dB up to 50 GHz. Based on the frequency domain response, the CFC and LMFC flip-chip interconnects are characterized in the time domain using eye-diagram. The simulated eye-diagram performance of the LMFC interconnect indicates that introducing the air cavity and trench to the CFC interconnect improves the multi-gigabits digital signal transmission significantly and the LMFC interconnect could operate at 40 Gb/s bit rate.

Original languageEnglish (US)
Title of host publication2008 Proceedings 58th Electronic Components and Technology Conference, ECTC
Pages1372-1377
Number of pages6
DOIs
StatePublished - Sep 15 2008
Event2008 58th Electronic Components and Technology Conference, ECTC - Lake Buena Vista, FL, United States
Duration: May 27 2008May 30 2008

Publication series

NameProceedings - Electronic Components and Technology Conference
ISSN (Print)0569-5503

Other

Other2008 58th Electronic Components and Technology Conference, ECTC
Country/TerritoryUnited States
CityLake Buena Vista, FL
Period5/27/085/30/08

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