High-Resolution, high-aspect-ratio printed and plated metal conductors utilizing roll-to-roll microscale uv imprinting with prototype imprinting stamps

Krystopher S. Jochem, Wieslaw J Suszynski, Daniel Frisbie, Lorraine F Francis

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14 Scopus citations


Micron-scale, high-aspect-ratio features were imprinted by a roll-to-roll process into a UV-curable polymer and used to create high-current-carrying conductive networks on plastic substrates. A stamp fabrication method was developed to create low-cost, rapidly produced roll-to-roll imprinting stamps, which can mold features from 3 μm to 1 mm wide. Isolated raised features 50 μm high were molded from a 25-μm-thick layer of UV-curable resin by displacing resin into raised features in the stamp. Substrates with imprinted capillary channels were used to form electrical conductors by printing a silver ink into reservoirs connected to the channels and allowing capillary flow to coat the channel. Copper electroless plating then filled the channels. The conductors demonstrate high resolution, high aspect ratio (5:1 height:width), low resistance per length, and easy integration into networks. This roll-to-roll imprinting process provides a foundation for high-throughput manufacturing of high-resolution printed electronics.

Original languageEnglish (US)
Pages (from-to)16335-16346
Number of pages12
JournalIndustrial and Engineering Chemistry Research
Issue number48
StatePublished - Dec 5 2018

Bibliographical note

Funding Information:
This work was initially supported by the Multi-University Research Initiative program sponsored by the Office of Naval Research (Award N00014-11-1-0690) and then by the National Science Foundation (NSF; Award CMMI-1634263). K.S.J. gratefully acknowledges support from the NSF Graduate Research Fellowship Program under Grant 00039202. Any opinions, findings, and conclusions or recommendations expressed in this material are those of the authors and do not necessarily reflect the views of the National Science Foundation. The authors thank F. Zare Bidoky, Dr. D. Song, and Dr. W. J. Hyun for valuable discussion. The authors thank S. B. Walker and J. L. Lewis for the silver ink used in this research. Parts of this work were carried out in the Characterization Facility, University of Minnesota, which receives partial support from the NSF through the MRSEC program. Portions of this work were conducted in the Minnesota Nano Center, which is supported by the NSF through the National Nano Coordinated Infrastructure Network under Award ECCS-1542202.

Publisher Copyright:
© 2018 American Chemical Society.

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