High-resolution, high-aspect ratio conductive wires embedded in plastic substrates

Ankit Mahajan, Woo Jin Hyun, S. Brett Walker, Jennifer A. Lewis, Lorraine F. Francis, C. Daniel Frisbie

Research output: Contribution to journalArticle

32 Scopus citations

Abstract

A novel method is presented to fabricate high-resolution, high-aspect ratio metal wires embedded in a plastic substrate for flexible electronics applications. In a sequential process, high-resolution channels connected to low-resolution reservoirs are first created in a thermosetting polymer by imprint lithography. A reactive Ag ink is then inkjet-printed into the reservoirs and wicked into the channels by capillary forces. These features serve as a seed layer for copper deposition inside the channels via electroless plating. Highly conductive wires (>50% bulk metal) with minimum line width and spacing of 2 and 4 μm, respectively, and an aspect ratio of 0.6 are obtained. The embedded wires exhibit good mechanical flexibility, with minimal degradation in electrical performance after thousands of bending cycles.

Original languageEnglish (US)
Pages (from-to)1841-1847
Number of pages7
JournalACS Applied Materials and Interfaces
Volume7
Issue number3
DOIs
StatePublished - Jan 28 2015

Keywords

  • copper electroless plating
  • flexible electronics
  • high-resolution metal lines
  • imprint lithography
  • inkjet printing

How much support was provided by MRSEC?

  • Shared

Reporting period for MRSEC

  • Period 1

PubMed: MeSH publication types

  • Journal Article
  • Research Support, U.S. Gov't, Non-P.H.S.

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