High power-density, hybrid inductive/capacitive converter with area reuse for multi-domain DVS

Sudhir Kudva; Saurabh Chaubey; Ramesh Harjani

doi:10.1109/CICC.2014.6946053

High power-density, hybrid inductive/capacitive converter with area reuse for multi-domain DVS

Sudhir Kudva
, Saurabh Chaubey
, Ramesh Harjani

Electrical and Computer Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

6 Scopus citations

Abstract

This paper presents a fully integrated hybrid inductive/capacitive converter that supports 70X output power range while maintaining high efficiency. This high efficiency is achieved by using an inductive converter for larger loads and a capacitive converter for lower loads. We have also shown the feasibility of implementing digital circuits under the inductor increasing the peak converter power density from 0.387 W/sq-mm to 4.1 W/sq-mm with only a minor hit on the efficiency. The maximum measured efficiency decreases from 76.4% to 71% when the digital circuits under inductor are present. The design has been fabricated in IBM's 32nm SOI technology.

Original language	English (US)
Title of host publication	Proceedings of the IEEE 2014 Custom Integrated Circuits Conference, CICC 2014
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)	9781479932863
DOIs	https://doi.org/10.1109/CICC.2014.6946053
State	Published - Nov 4 2014
Event	36th Annual Custom Integrated Circuits Conference - The Showcase for Integrated Circuit Design in the Heart of Silicon Valley, CICC 2014 - San Jose, United States Duration: Sep 15 2014 → Sep 17 2014

Publication series

Name	Proceedings of the IEEE 2014 Custom Integrated Circuits Conference, CICC 2014

Other

Other	36th Annual Custom Integrated Circuits Conference - The Showcase for Integrated Circuit Design in the Heart of Silicon Valley, CICC 2014
Country/Territory	United States
City	San Jose
Period	9/15/14 → 9/17/14

Bibliographical note

Publisher Copyright:
© 2014 IEEE.

Publisher link

10.1109/CICC.2014.6946053

Find It

Find It at U of M Libraries

Cite this

Kudva, S., Chaubey, S., & Harjani, R. (2014). High power-density, hybrid inductive/capacitive converter with area reuse for multi-domain DVS. In Proceedings of the IEEE 2014 Custom Integrated Circuits Conference, CICC 2014 Article 6946053 (Proceedings of the IEEE 2014 Custom Integrated Circuits Conference, CICC 2014). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/CICC.2014.6946053

High power-density, hybrid inductive/capacitive converter with area reuse for multi-domain DVS. / Kudva, Sudhir; Chaubey, Saurabh; Harjani, Ramesh.
Proceedings of the IEEE 2014 Custom Integrated Circuits Conference, CICC 2014. Institute of Electrical and Electronics Engineers Inc., 2014. 6946053 (Proceedings of the IEEE 2014 Custom Integrated Circuits Conference, CICC 2014).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Kudva, S, Chaubey, S & Harjani, R 2014, High power-density, hybrid inductive/capacitive converter with area reuse for multi-domain DVS. in Proceedings of the IEEE 2014 Custom Integrated Circuits Conference, CICC 2014., 6946053, Proceedings of the IEEE 2014 Custom Integrated Circuits Conference, CICC 2014, Institute of Electrical and Electronics Engineers Inc., 36th Annual Custom Integrated Circuits Conference - The Showcase for Integrated Circuit Design in the Heart of Silicon Valley, CICC 2014, San Jose, United States, 9/15/14. https://doi.org/10.1109/CICC.2014.6946053

Kudva S, Chaubey S, Harjani R. High power-density, hybrid inductive/capacitive converter with area reuse for multi-domain DVS. In Proceedings of the IEEE 2014 Custom Integrated Circuits Conference, CICC 2014. Institute of Electrical and Electronics Engineers Inc. 2014. 6946053. (Proceedings of the IEEE 2014 Custom Integrated Circuits Conference, CICC 2014). doi: 10.1109/CICC.2014.6946053

Kudva, Sudhir ; Chaubey, Saurabh ; Harjani, Ramesh. / High power-density, hybrid inductive/capacitive converter with area reuse for multi-domain DVS. Proceedings of the IEEE 2014 Custom Integrated Circuits Conference, CICC 2014. Institute of Electrical and Electronics Engineers Inc., 2014. (Proceedings of the IEEE 2014 Custom Integrated Circuits Conference, CICC 2014).

@inproceedings{16ca7561b9744f58bf2813c50a359880,

title = "High power-density, hybrid inductive/capacitive converter with area reuse for multi-domain DVS",

abstract = "This paper presents a fully integrated hybrid inductive/capacitive converter that supports 70X output power range while maintaining high efficiency. This high efficiency is achieved by using an inductive converter for larger loads and a capacitive converter for lower loads. We have also shown the feasibility of implementing digital circuits under the inductor increasing the peak converter power density from 0.387 W/sq-mm to 4.1 W/sq-mm with only a minor hit on the efficiency. The maximum measured efficiency decreases from 76.4\% to 71\% when the digital circuits under inductor are present. The design has been fabricated in IBM's 32nm SOI technology.",

author = "Sudhir Kudva and Saurabh Chaubey and Ramesh Harjani",

note = "Publisher Copyright: {\textcopyright} 2014 IEEE.; 36th Annual Custom Integrated Circuits Conference - The Showcase for Integrated Circuit Design in the Heart of Silicon Valley, CICC 2014 ; Conference date: 15-09-2014 Through 17-09-2014",

year = "2014",

month = nov,

day = "4",

doi = "10.1109/CICC.2014.6946053",

language = "English (US)",

series = "Proceedings of the IEEE 2014 Custom Integrated Circuits Conference, CICC 2014",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

booktitle = "Proceedings of the IEEE 2014 Custom Integrated Circuits Conference, CICC 2014",

}

TY - GEN

T1 - High power-density, hybrid inductive/capacitive converter with area reuse for multi-domain DVS

AU - Kudva, Sudhir

AU - Chaubey, Saurabh

AU - Harjani, Ramesh

PY - 2014/11/4

Y1 - 2014/11/4

N2 - This paper presents a fully integrated hybrid inductive/capacitive converter that supports 70X output power range while maintaining high efficiency. This high efficiency is achieved by using an inductive converter for larger loads and a capacitive converter for lower loads. We have also shown the feasibility of implementing digital circuits under the inductor increasing the peak converter power density from 0.387 W/sq-mm to 4.1 W/sq-mm with only a minor hit on the efficiency. The maximum measured efficiency decreases from 76.4% to 71% when the digital circuits under inductor are present. The design has been fabricated in IBM's 32nm SOI technology.

AB - This paper presents a fully integrated hybrid inductive/capacitive converter that supports 70X output power range while maintaining high efficiency. This high efficiency is achieved by using an inductive converter for larger loads and a capacitive converter for lower loads. We have also shown the feasibility of implementing digital circuits under the inductor increasing the peak converter power density from 0.387 W/sq-mm to 4.1 W/sq-mm with only a minor hit on the efficiency. The maximum measured efficiency decreases from 76.4% to 71% when the digital circuits under inductor are present. The design has been fabricated in IBM's 32nm SOI technology.

UR - https://www.scopus.com/pages/publications/84928139967

UR - https://www.scopus.com/pages/publications/84928139967#tab=citedBy

U2 - 10.1109/CICC.2014.6946053

DO - 10.1109/CICC.2014.6946053

M3 - Conference contribution

AN - SCOPUS:84928139967

T3 - Proceedings of the IEEE 2014 Custom Integrated Circuits Conference, CICC 2014

BT - Proceedings of the IEEE 2014 Custom Integrated Circuits Conference, CICC 2014

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 36th Annual Custom Integrated Circuits Conference - The Showcase for Integrated Circuit Design in the Heart of Silicon Valley, CICC 2014

Y2 - 15 September 2014 through 17 September 2014

ER -

High power-density, hybrid inductive/capacitive converter with area reuse for multi-domain DVS

Abstract

Publication series

Other

Bibliographical note

Publisher link

Find It

Other files and links

Fingerprint

Cite this