Abstract
High permittivity HfO2 films have been deposited directly on silicon using the thermal decomposition of the hafnium nitrato precursor Hf(NO3)4. These films were then used to build n- and p-channel field effect transistors. N+ poly, P+ poly, and Pt have been used as gate electrodes. The mobility of the poly gate devices is comparable to that of SiO2/Si, however, these devices show a thicker equivalent oxide thickness than the Pt devices. The effect of the composition of the films on their electrical performance is discussed.
Original language | English (US) |
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Pages (from-to) | 361-365 |
Number of pages | 5 |
Journal | Microelectronic Engineering |
Volume | 59 |
Issue number | 1-4 |
DOIs | |
State | Published - Nov 2001 |
Event | 12th Biannual Conference on Insulating Films on Semi-Conductors (INFOS 2001) - Udine, Italy Duration: Jun 20 2001 → Jun 23 2001 |
Bibliographical note
Funding Information:The authors wish to acknowledge Motorola, who supported this work through the Semiconductor Research Corporation Research Customization Program (contract 731).
Keywords
- Gate insulator
- High permittivity
- MOSFET
- Mobility