High frequency circuit components on micromachined variable thickness substrates

R. F. Drayton; R. M. Henderson; L. P.B. Katehi

doi:10.1049/el:19970221

High frequency circuit components on micromachined variable thickness substrates

R. F. Drayton, R. M. Henderson, L. P.B. Katehi

Research output: Contribution to journal › Article › peer-review

5 Scopus citations

Abstract

The use of Si micromachining techniques to enhance high frequency planar circuit design flexibility by offering a method for varying the substrate thickness in selective locations on the wafer is presented.

Original language	English (US)
Pages (from-to)	303-304
Number of pages	2
Journal	Electronics Letters
Volume	33
Issue number	4
DOIs	https://doi.org/10.1049/el:19970221
State	Published - Feb 13 1997
Externally published	Yes

Keywords

Micromachining
Microwave circuits
Silicon

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

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10.1049/el:19970221

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title = "High frequency circuit components on micromachined variable thickness substrates",

abstract = "The use of Si micromachining techniques to enhance high frequency planar circuit design flexibility by offering a method for varying the substrate thickness in selective locations on the wafer is presented.",

keywords = "Micromachining, Microwave circuits, Silicon",

author = "Drayton, \{R. F.\} and Henderson, \{R. M.\} and Katehi, \{L. P.B.\}",

year = "1997",

month = feb,

day = "13",

doi = "10.1049/el:19970221",

language = "English (US)",

volume = "33",

pages = "303--304",

journal = "Electronics Letters",

issn = "0013-5194",

publisher = "John Wiley \& Sons Inc.",

number = "4",

}

TY - JOUR

T1 - High frequency circuit components on micromachined variable thickness substrates

AU - Drayton, R. F.

AU - Henderson, R. M.

AU - Katehi, L. P.B.

PY - 1997/2/13

Y1 - 1997/2/13

N2 - The use of Si micromachining techniques to enhance high frequency planar circuit design flexibility by offering a method for varying the substrate thickness in selective locations on the wafer is presented.

AB - The use of Si micromachining techniques to enhance high frequency planar circuit design flexibility by offering a method for varying the substrate thickness in selective locations on the wafer is presented.

KW - Micromachining

KW - Microwave circuits

KW - Silicon

UR - https://www.scopus.com/pages/publications/0031078111

UR - https://www.scopus.com/inward/citedby.url?scp=0031078111&partnerID=8YFLogxK

U2 - 10.1049/el:19970221

DO - 10.1049/el:19970221

M3 - Article

AN - SCOPUS:0031078111

SN - 0013-5194

VL - 33

SP - 303

EP - 304

JO - Electronics Letters

JF - Electronics Letters

IS - 4

ER -

High frequency circuit components on micromachined variable thickness substrates

Abstract

Keywords

UN SDGs

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