Abstract
The use of Si micromachining techniques to enhance high frequency planar circuit design flexibility by offering a method for varying the substrate thickness in selective locations on the wafer is presented.
Original language | English (US) |
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Pages (from-to) | 303-304 |
Number of pages | 2 |
Journal | Electronics Letters |
Volume | 33 |
Issue number | 4 |
DOIs | |
State | Published - Feb 13 1997 |
Externally published | Yes |
Keywords
- Micromachining
- Microwave circuits
- Silicon