The relative performance of a hierarchy of broadband amplifier designs is examined. This design hierarchy consists of an emitter-coupled pair with resistive-shunt loading for baseline comparison, a compound-device amplifier, a compensated series-feedback amplifier, and an actively shunt-peaked amplifier. Both pole-zero compensated amplifiers incorporate compound devices. The circuits are fabricated on Tektronix Inc.'s analog array chip featuring the SH3 process with 6.5 fT transistors.
|Original language||English (US)|
|Number of pages||5|
|Journal||Proceedings - IEEE International Symposium on Circuits and Systems|
|State||Published - Dec 1 1990|
|Event||1990 IEEE International Symposium on Circuits and Systems Part 4 (of 4) - New Orleans, LA, USA|
Duration: May 1 1990 → May 3 1990