Heat transfer and cure in pultrusion: Model and experimental verification

Gibson L. Batch, Chris Macosko

Research output: Contribution to journalArticlepeer-review

33 Scopus citations


Though pultrusion has existed for nearly 40 years, factors affecting temperature and resin reactivity are not completely understood. A model is tested to help explain the effects of die temperature, line speed and initiator concentration on curing inside a pultrusion die. The model includes radio frequency preheating, heat conduction, heat of cure, changing thermal properties with temperature and degree of cure, and hindered heat transfer due to shrinkage of the profile away from the die. The analysis is compared to experimental temperature measurements for a 1‐in. (25‐mm) round die, where die temperature, line speed, and initiator concentration were varied. Temperature predictions by the model are in good agreement with the data for many of the conditions tested. Considerable disagreement still persists, however, under processing conditions with faster line speeds and lower die temperatures.

Original languageEnglish (US)
Pages (from-to)1228-1241
Number of pages14
JournalAIChE Journal
Issue number7
StatePublished - Jul 1993

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