Abstract
Germanium and silicon have lagged behind more popular II-VI and IV-VI semiconductor materials in the emerging field of semiconductor nanocrystal thin film devices. We report germanium and silicon nanocrystal field-effect transistors fabricated by synthesizing nanocrystals in a plasma, transferring them into solution, and casting thin films. Germanium devices show n-type, ambipolar, or p-type behavior depending on annealing temperature with electron and hole mobilities as large as 0.02 and 0.006 cm2 V-1 s-1, respectively. Silicon devices exhibit n-type behavior without any postdeposition treatment, but are plagued by poor film morphology.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 2661-2666 |
| Number of pages | 6 |
| Journal | Nano letters |
| Volume | 10 |
| Issue number | 7 |
| DOIs | |
| State | Published - Jul 14 2010 |
Keywords
- FET
- Germanium
- Nanocrystal
- Silicon
- Thin film
- Transistor
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