Abstract
Gate oxide tunneling current (Igate) is comparable to subthreshold leakage current in CMOS circuits when the equivalent physical oxide thickness (Tox) is below 15 ̊. Increasing the value of T ox reduces the leakage at the expense of increased delay, and hence a practical tradeoff between delay and leakage can be achieved by assigning one of two permissible Tox values to each transistor. In this paper, we propose an algorithm for dual-Tox assignment to optimize the total leakage power under delay constraints and generate a leakage/delay tradeoff curve. As compared to the case where all transistors are set to low T ox, our approach achieves an average leakage reduction of 86% under 100 nm models and 81 % under 70 nm models. We also propose a transistor and pin reordering technique that has minimal layout impact to further reduce the total leakage current up to 12% and Igate up to 27% without incurring any delay penalty.
Original language | English (US) |
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Pages (from-to) | 1362-1375 |
Number of pages | 14 |
Journal | IEEE Transactions on Very Large Scale Integration (VLSI) Systems |
Volume | 13 |
Issue number | 12 |
DOIs | |
State | Published - Dec 1 2005 |
Keywords
- Dual oxide thicknesses
- Gate leakage
- Leakage power
- Pin reordering
- Power delay tradeoffs
- Subthreshold leakage
- Technology scaling
- Transistor reordering