Free Space Vertical Interconnects using Near Field Coupling Antennas in a Fabry-Perot Cavity Environment

Aditya Dave, Rhonda Franklin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Vertical interconnects (or vias) are used extensively with the aggressive scaling of device geometries and to obtain more performance from a limited area in 3D integrated systems. As circuit layers increase, so do fabrication challenges and high frequency performance degradation with vias. A novel low loss free space vertical interconnect is proposed using Fabry-Perot-Cavity antenna system in the near field. A 12GHz design is demonstrated that couples signal between two patch antennas through a frequency selective surface (FSS). The design has an insertion loss of 1.34dB and is close to the insertion loss (0.8dB) of a though line. When compared to a 2 layer microstrip line with metal vias, the proposed solution's insertion loss is 2.64dB lower. In summary, this novel system offers low loss and isolation in an approach that is scalable for use in higher frequency applications (i.e. 60GHz or 5G) where excessive loss is prohibitive.

Original languageEnglish (US)
Title of host publication2019 IEEE MTT-S International Microwave Symposium, IMS 2019
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1054-1056
Number of pages3
ISBN (Electronic)9781728113098
StatePublished - Jun 2019
Event2019 IEEE MTT-S International Microwave Symposium, IMS 2019 - Boston, United States
Duration: Jun 2 2019Jun 7 2019

Publication series

NameIEEE MTT-S International Microwave Symposium Digest
Volume2019-June
ISSN (Print)0149-645X

Conference

Conference2019 IEEE MTT-S International Microwave Symposium, IMS 2019
CountryUnited States
CityBoston
Period6/2/196/7/19

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Keywords

  • Fabry-Perot
  • Free-space
  • Interconnects
  • Packaging

Cite this

Dave, A., & Franklin, R. (2019). Free Space Vertical Interconnects using Near Field Coupling Antennas in a Fabry-Perot Cavity Environment. In 2019 IEEE MTT-S International Microwave Symposium, IMS 2019 (pp. 1054-1056). [8701074] (IEEE MTT-S International Microwave Symposium Digest; Vol. 2019-June). Institute of Electrical and Electronics Engineers Inc..