Abstract
Finite element simulations, with an axisymmetric model representation, were employed to investigate the thermo-structural behavior of a thermally-pulsed plastic Integrated Circuit package. The spatial and temporal variations in temperature, strain, and stress were analyzed for a PLCC with single and multiple delaminated chip/encapsulant interfaces. The axisymmetric model included thermal contact resistance and structural `slip' at the delaminated interfaces. The influence of delamination at different interfaces was evaluated and the results were compared to the deformation and stress in an identical package, with perfectly adhering chip/encapsulant interfaces.
| Original language | English (US) |
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| Pages | 539-552 |
| Number of pages | 14 |
| State | Published - Jan 1 1995 |
| Event | Proceedings of the International Intersociety Electronic Packaging Conference - INTERpack'95. Part 1 (of 2) - Maui, HI, USA Duration: Mar 26 1995 → Mar 30 1995 |
Other
| Other | Proceedings of the International Intersociety Electronic Packaging Conference - INTERpack'95. Part 1 (of 2) |
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| City | Maui, HI, USA |
| Period | 3/26/95 → 3/30/95 |