Finite element simulation of strain/stress fields in delaminated plastic IC packages

Devin E. Mix, Avram Bar-Cohen, Kumar K. Tamma

Research output: Contribution to conferencePaper

4 Scopus citations

Abstract

Finite element simulations, with an axisymmetric model representation, were employed to investigate the thermo-structural behavior of a thermally-pulsed plastic Integrated Circuit package. The spatial and temporal variations in temperature, strain, and stress were analyzed for a PLCC with single and multiple delaminated chip/encapsulant interfaces. The axisymmetric model included thermal contact resistance and structural `slip' at the delaminated interfaces. The influence of delamination at different interfaces was evaluated and the results were compared to the deformation and stress in an identical package, with perfectly adhering chip/encapsulant interfaces.

Original languageEnglish (US)
Pages539-552
Number of pages14
StatePublished - Jan 1 1995
EventProceedings of the International Intersociety Electronic Packaging Conference - INTERpack'95. Part 1 (of 2) - Maui, HI, USA
Duration: Mar 26 1995Mar 30 1995

Other

OtherProceedings of the International Intersociety Electronic Packaging Conference - INTERpack'95. Part 1 (of 2)
CityMaui, HI, USA
Period3/26/953/30/95

    Fingerprint

Cite this

Mix, D. E., Bar-Cohen, A., & Tamma, K. K. (1995). Finite element simulation of strain/stress fields in delaminated plastic IC packages. 539-552. Paper presented at Proceedings of the International Intersociety Electronic Packaging Conference - INTERpack'95. Part 1 (of 2), Maui, HI, USA, .