Finite element analysis of thermal stresses in planar SOFCs

Xian Chen, Jie Yang, Jian Pu, Jian Li

Research output: Contribution to journalArticle

5 Scopus citations

Abstract

Finite Element Analysis (FEA) method was adopted to establish the thermal/structure model for planar SOFC and simulate the distribution of thermal stress and displacement caused by a uniform temperature field as a consequence of coefficient of thermal expansion (CTE) mismatch among the SOFC component materials. The calculated results were analyzed and discussed, which can be used as the guide for the single cell materials selection and structure design. The calculations indicate that the maximum stress appears on the electrode/electrolyte interface; the value and distribution of the interface stress are the functions of electrode material CTEs and applied temperature field. FEA software ANSYS was employed, and according to the structural characteristics of the planar SOFC, the procedures of establishing model, defining nodals, applying load and calculating were performed.

Original languageEnglish (US)
Pages (from-to)339-343
Number of pages5
JournalWuji Cailiao Xuebao/Journal of Inorganic Materials
Volume22
Issue number2
StatePublished - Mar 2007

Keywords

  • Coefficient of thermal expansion
  • Finite element
  • Planar SOFC
  • Thermal stress

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