Fiducial marks as measures of thin film crack arrest toughness

Alex A. Volinsky, Michael L. Kottke, Neville R. Moody, William W. Gerberich

Research output: Contribution to journalArticlepeer-review

1 Scopus citations


Carbon fiducial marks are formed during thin film local delamination processes induced either by indentation. forming circular blisters, or by residual stress relief through telephone cord blister formations. Hydrocarbons are sucked into the crack tip during the delamination processes, outlining the crack tip opening angle, which can be used to back calculate thin film adhesion using elastic or plastic analyses presented in the paper.

Original languageEnglish (US)
Pages (from-to)1511-1515
Number of pages5
JournalEngineering Fracture Mechanics
Issue number13
StatePublished - Sep 2002

Bibliographical note

Funding Information:
The authors would like to acknowledge support through DOE grants DE-FG02/96ER45574 and DE-AC04-94AL85000. We would also like to acknowledge W. Miles Clift and Bernice E. Mills from Sandia National Lab at Livermore for Auger analysis, Indira S. Adhihetty from Motorola and Robert F. Cook from the University of Minnesota for valuable discussions.


  • Adhesion
  • Crack arrest
  • Crack tip opening angle
  • Delamination
  • Fiducial marks
  • Fracture
  • Thin films


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