Fiducial marks as measures of thin film crack arrest toughness

Alex A. Volinsky; Michael L. Kottke; Neville R. Moody; William W. Gerberich

doi:10.1016/S0013-7944(02)00003-6

Fiducial marks as measures of thin film crack arrest toughness

Alex A. Volinsky, Michael L. Kottke, Neville R. Moody, William W. Gerberich

Chemical Engineering and Materials Science

Research output: Contribution to journal › Article › peer-review

1 Scopus citations

Abstract

Carbon fiducial marks are formed during thin film local delamination processes induced either by indentation. forming circular blisters, or by residual stress relief through telephone cord blister formations. Hydrocarbons are sucked into the crack tip during the delamination processes, outlining the crack tip opening angle, which can be used to back calculate thin film adhesion using elastic or plastic analyses presented in the paper.

Original language	English (US)
Pages (from-to)	1511-1515
Number of pages	5
Journal	Engineering Fracture Mechanics
Volume	69
Issue number	13
DOIs	https://doi.org/10.1016/S0013-7944(02)00003-6
State	Published - Sep 2002

Bibliographical note

Funding Information:
The authors would like to acknowledge support through DOE grants DE-FG02/96ER45574 and DE-AC04-94AL85000. We would also like to acknowledge W. Miles Clift and Bernice E. Mills from Sandia National Lab at Livermore for Auger analysis, Indira S. Adhihetty from Motorola and Robert F. Cook from the University of Minnesota for valuable discussions.

Keywords

Adhesion
Crack arrest
Crack tip opening angle
Delamination
Fiducial marks
Fracture
Thin films

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10.1016/S0013-7944(02)00003-6

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@article{144b19fbc97143fb9eda29036814781a,

title = "Fiducial marks as measures of thin film crack arrest toughness",

abstract = "Carbon fiducial marks are formed during thin film local delamination processes induced either by indentation. forming circular blisters, or by residual stress relief through telephone cord blister formations. Hydrocarbons are sucked into the crack tip during the delamination processes, outlining the crack tip opening angle, which can be used to back calculate thin film adhesion using elastic or plastic analyses presented in the paper.",

keywords = "Adhesion, Crack arrest, Crack tip opening angle, Delamination, Fiducial marks, Fracture, Thin films",

author = "Volinsky, {Alex A.} and Kottke, {Michael L.} and Moody, {Neville R.} and Gerberich, {William W.}",

note = "Funding Information: The authors would like to acknowledge support through DOE grants DE-FG02/96ER45574 and DE-AC04-94AL85000. We would also like to acknowledge W. Miles Clift and Bernice E. Mills from Sandia National Lab at Livermore for Auger analysis, Indira S. Adhihetty from Motorola and Robert F. Cook from the University of Minnesota for valuable discussions.",

year = "2002",

month = sep,

doi = "10.1016/S0013-7944(02)00003-6",

language = "English (US)",

volume = "69",

pages = "1511--1515",

journal = "Engineering Fracture Mechanics",

issn = "0013-7944",

publisher = "Elsevier B.V.",

number = "13",

}

TY - JOUR

T1 - Fiducial marks as measures of thin film crack arrest toughness

AU - Volinsky, Alex A.

AU - Kottke, Michael L.

AU - Moody, Neville R.

AU - Gerberich, William W.

N1 - Funding Information: The authors would like to acknowledge support through DOE grants DE-FG02/96ER45574 and DE-AC04-94AL85000. We would also like to acknowledge W. Miles Clift and Bernice E. Mills from Sandia National Lab at Livermore for Auger analysis, Indira S. Adhihetty from Motorola and Robert F. Cook from the University of Minnesota for valuable discussions.

PY - 2002/9

Y1 - 2002/9

N2 - Carbon fiducial marks are formed during thin film local delamination processes induced either by indentation. forming circular blisters, or by residual stress relief through telephone cord blister formations. Hydrocarbons are sucked into the crack tip during the delamination processes, outlining the crack tip opening angle, which can be used to back calculate thin film adhesion using elastic or plastic analyses presented in the paper.

AB - Carbon fiducial marks are formed during thin film local delamination processes induced either by indentation. forming circular blisters, or by residual stress relief through telephone cord blister formations. Hydrocarbons are sucked into the crack tip during the delamination processes, outlining the crack tip opening angle, which can be used to back calculate thin film adhesion using elastic or plastic analyses presented in the paper.

KW - Adhesion

KW - Crack arrest

KW - Crack tip opening angle

KW - Delamination

KW - Fiducial marks

KW - Fracture

KW - Thin films

UR - http://www.scopus.com/inward/record.url?scp=0036722719&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0036722719&partnerID=8YFLogxK

U2 - 10.1016/S0013-7944(02)00003-6

DO - 10.1016/S0013-7944(02)00003-6

M3 - Article

AN - SCOPUS:0036722719

SN - 0013-7944

VL - 69

SP - 1511

EP - 1515

JO - Engineering Fracture Mechanics

JF - Engineering Fracture Mechanics

IS - 13

ER -

Fiducial marks as measures of thin film crack arrest toughness

Abstract

Bibliographical note

Keywords

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