Fiducial mark and CTOA estimates of thin film adhesion

Alex A. Volinsky; Neville R. Moody; William W Gerberich

doi:10.1023/a:1024983930481

Fiducial mark and CTOA estimates of thin film adhesion

Alex A. Volinsky, Neville R. Moody, William W Gerberich

Chemical Engineering and Materials Science

Research output: Contribution to journal › Article › peer-review

7 Scopus citations

Abstract

Carbon fiducial marks are formed during thin film local delamination processes induced either by superlayer indentation forming circular blisters, or by residual stress relief through telephone cord blister formations. Hydrocarbons are sucked into the crack tip during the delamination process, outlining the crack tip opening angle (CTOA), which can be used to back calculate thin film adhesion using either elastic or plastic analyses presented here. Fiducial marks have been observed in two different thin films systems, namely Cu/SiO₂ and TiW_XN_Y/GaAs. TiW_XN_y/GaAs system also exhibited biaxial compressive stress-induced phone cord buckling delaminations. Surface AFM CTOA measurement approach is used to estimate the strain energy release rate increase along these phone cords delaminations.

Original language	English (US)
Pages (from-to)	431-439
Number of pages	9
Journal	International Journal of Fracture
Volume	120
Issue number	1-2
DOIs	https://doi.org/10.1023/a:1024983930481
State	Published - 2003

Keywords

Adhesion
Crack arrest
Crack tip opening angle
Delamination
Fiducial marks
Fracture
Thin films

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10.1023/a:1024983930481

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title = "Fiducial mark and CTOA estimates of thin film adhesion",

abstract = "Carbon fiducial marks are formed during thin film local delamination processes induced either by superlayer indentation forming circular blisters, or by residual stress relief through telephone cord blister formations. Hydrocarbons are sucked into the crack tip during the delamination process, outlining the crack tip opening angle (CTOA), which can be used to back calculate thin film adhesion using either elastic or plastic analyses presented here. Fiducial marks have been observed in two different thin films systems, namely Cu/SiO2 and TiWXNY/GaAs. TiWXNy/GaAs system also exhibited biaxial compressive stress-induced phone cord buckling delaminations. Surface AFM CTOA measurement approach is used to estimate the strain energy release rate increase along these phone cords delaminations.",

keywords = "Adhesion, Crack arrest, Crack tip opening angle, Delamination, Fiducial marks, Fracture, Thin films",

author = "Volinsky, {Alex A.} and Moody, {Neville R.} and Gerberich, {William W}",

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language = "English (US)",

volume = "120",

pages = "431--439",

journal = "International Journal of Fracture",

issn = "0376-9429",

publisher = "Springer Netherlands",

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T1 - Fiducial mark and CTOA estimates of thin film adhesion

AU - Volinsky, Alex A.

AU - Moody, Neville R.

AU - Gerberich, William W

PY - 2003

Y1 - 2003

N2 - Carbon fiducial marks are formed during thin film local delamination processes induced either by superlayer indentation forming circular blisters, or by residual stress relief through telephone cord blister formations. Hydrocarbons are sucked into the crack tip during the delamination process, outlining the crack tip opening angle (CTOA), which can be used to back calculate thin film adhesion using either elastic or plastic analyses presented here. Fiducial marks have been observed in two different thin films systems, namely Cu/SiO2 and TiWXNY/GaAs. TiWXNy/GaAs system also exhibited biaxial compressive stress-induced phone cord buckling delaminations. Surface AFM CTOA measurement approach is used to estimate the strain energy release rate increase along these phone cords delaminations.

AB - Carbon fiducial marks are formed during thin film local delamination processes induced either by superlayer indentation forming circular blisters, or by residual stress relief through telephone cord blister formations. Hydrocarbons are sucked into the crack tip during the delamination process, outlining the crack tip opening angle (CTOA), which can be used to back calculate thin film adhesion using either elastic or plastic analyses presented here. Fiducial marks have been observed in two different thin films systems, namely Cu/SiO2 and TiWXNY/GaAs. TiWXNy/GaAs system also exhibited biaxial compressive stress-induced phone cord buckling delaminations. Surface AFM CTOA measurement approach is used to estimate the strain energy release rate increase along these phone cords delaminations.

KW - Adhesion

KW - Crack arrest

KW - Crack tip opening angle

KW - Delamination

KW - Fiducial marks

KW - Fracture

KW - Thin films

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JO - International Journal of Fracture

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Fiducial mark and CTOA estimates of thin film adhesion

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