TY - JOUR
T1 - Fabrication of polymer via holes by a combination of hot embossing and indentation processes
AU - Zhu, Xuelin
AU - Cui, Tianhong
PY - 2011/4/1
Y1 - 2011/4/1
N2 - In this paper, a new fabrication approach of a polymer micro via hole array on a large area substrate is presented by a combination of hot embossing and indentation processes. Polymer via holes were formed by hot embossing, and opened by an indentation process. An aluminum alloy buffer layer, as a receptor of pins on a stainless steel mold due to the low hardness of aluminum, was used to support a polymer sheet. The via hole array was fabricated by a sequential process of hot embossing and indentation. Polymer micro via hole arrays 100 μm to 1.0 mm in diameter were fabricated on a 10 cm × 10 cm area successfully. This facile approach is promising for a low-cost mass fabrication of polymer micro via arrays on a large area substrate.
AB - In this paper, a new fabrication approach of a polymer micro via hole array on a large area substrate is presented by a combination of hot embossing and indentation processes. Polymer via holes were formed by hot embossing, and opened by an indentation process. An aluminum alloy buffer layer, as a receptor of pins on a stainless steel mold due to the low hardness of aluminum, was used to support a polymer sheet. The via hole array was fabricated by a sequential process of hot embossing and indentation. Polymer micro via hole arrays 100 μm to 1.0 mm in diameter were fabricated on a 10 cm × 10 cm area successfully. This facile approach is promising for a low-cost mass fabrication of polymer micro via arrays on a large area substrate.
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U2 - 10.1088/0960-1317/21/4/045032
DO - 10.1088/0960-1317/21/4/045032
M3 - Article
AN - SCOPUS:79953667541
SN - 0960-1317
VL - 21
JO - Journal of Micromechanics and Microengineering
JF - Journal of Micromechanics and Microengineering
IS - 4
M1 - 045032
ER -