Fabrication of 3D nanostructures with lithographically patterned surfaces by self-folding

Jeong Hyun Cho, Teena James, D. H. Gracias

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Scopus citations

Abstract

One of the important challenges in nanoscale manufacturing is the construction of simultaneously patterned three dimensional structures, materials and devices. Since we live in a three dimensional world, such capabilities are needed to fully realize the capabilities of nanotechnology. We describe self-assembly processes based on utilizing intrinsic stress and inducing grain coalescence (extrinsic stress) in thin metal films that can be used to curve or fold lithographically patterned two dimensional (2D) panels into 3D structures. We discuss the use of intrinsic chromium (Cr) stresses and extrinsic stresses based on induced grain coalescence in tin (Sn) based structures with varying material composition to create a variety of lithographically patterned curved and polyhedral structures.

Original languageEnglish (US)
Title of host publicationInstrumentation, Metrology, and Standards for Nanomanufacturing IV
DOIs
StatePublished - Nov 8 2010
EventInstrumentation, Metrology, and Standards for Nanomanufacturing IV - San Diego, CA, United States
Duration: Aug 2 2010Aug 4 2010

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume7767
ISSN (Print)0277-786X

Conference

ConferenceInstrumentation, Metrology, and Standards for Nanomanufacturing IV
CountryUnited States
CitySan Diego, CA
Period8/2/108/4/10

Keywords

  • Nanofabrication
  • nanotechnology
  • self assembly

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