Keyphrases
Delamination
100%
Indentation
100%
Adhesion Test
100%
Multilayer Thin Films
100%
Nanoindentation
66%
Silica
33%
Film Microstructure
33%
Multilayer Film
33%
Fracture Process
33%
Residual Stress
33%
Adhesion Energy
33%
Copper Film
33%
Film Properties
33%
Linear Elastic Fracture Mechanics
33%
Strain Energy Release Rate
33%
Strong Interface
33%
No Sample Preparation
33%
Tungsten Thin Film
33%
Engineering
Indentation
100%
Thin Films
100%
Delamination
75%
Experimental Result
25%
Significant Change
25%
Film Property
25%
Residual Stress
25%
Linear Elastic Fracture Mechanic
25%
Strain-Energy Release Rate
25%
Multilayer Film
25%
Silicon Dioxide
25%
Material Science
Film
100%
Indentation
100%
Thin Films
100%
Delamination
50%
Nanoindentation
33%
Fracture Mechanics
16%
Tungsten
16%
Multilayer Film
16%
Residual Stress
16%
Linear Elastic Fracture
16%