Evaluation of a thermal interface material fabricated using thermocompression bonding of carbon nanotube turf

In this work a thermal interface material fabricated by thermocompression bonding of vertically aligned carbon nanotube turf (VACNT) to metallized substrates was characterized. The VACNT structure was fabricated onto silicon substrates using chemical vapor deposition. The structures were then transferred to metallized substrates using thermocompression bonding. The resulting structure consisted of VACNT turf sandwiched between two layers of Au. Two configurations of VACNT, full coverage and patterned, were fabricated and tested. In addition, the thermal interface resistance of structures at intermediate steps in the thermocompression bonding process were measured. For the full coverage turf a thermal interface resistance of 1.082 cm ²°CW^-1 at an applied load of 1N was measured, while a thermal interface resistance of 0.044 cm²°CW^-1 at a load of 1N was measured for the patterned turf configuration.