Evaluation of a thermal interface material fabricated using thermocompression bonding of carbon nanotube turf

Amer M. Hamdan, Jeong H. Cho, Ryan D. Johnson, David P. Bahr, Robert F. Richards, Cecilia D. Richards, Jun Jiao

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this work, the use of vertically aligned carbon nanotubes (VACNTs) as thermal interface materials is presented. The VACNT structure is fabricated on 4x4 mm silicon substrates using chemical vapor deposition (CVD). These VACNT structures can be transferred to other substrates using a thermocompression bonding process; the process transfers the VACNTs to metalized silicon die which are tested after that as thermal interface materials. Two configurations of VACNTs were tested: one with a full coverage of VACNTs and one with patterned VACNTs. For the full coverage turf a thermal interface resistance as low as 1.082 cm2K/W was obtained, while a thermal interface resistance of 0.044 cm2K/W was obtained for the patterned turfs.

Original languageEnglish (US)
Title of host publicationProceedings of the ASME International Mechanical Engineering Congress and Exposition 2009, IMECE 2009
PublisherAmerican Society of Mechanical Engineers (ASME)
Pages981-987
Number of pages7
EditionPART B
ISBN (Print)9780791843857
DOIs
StatePublished - Jan 1 2010
EventASME 2009 International Mechanical Engineering Congress and Exposition, IMECE2009 - Lake Buena Vista, FL, United States
Duration: Nov 13 2009Nov 19 2009

Publication series

NameASME International Mechanical Engineering Congress and Exposition, Proceedings
NumberPART B
Volume12

Other

OtherASME 2009 International Mechanical Engineering Congress and Exposition, IMECE2009
CountryUnited States
CityLake Buena Vista, FL
Period11/13/0911/19/09

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