TY - GEN
T1 - Errors in skin temperature measurements
AU - Dugay, M. V.
AU - Sparrow, Ephraim M
AU - Boetcher, S. K.S.
PY - 2009/9/21
Y1 - 2009/9/21
N2 - Numerical simulation is used to investigate the accuracy of a widely used direct-contact device for measuring skin-surface temperature. The device incorporates a foam pad which functions as a de facto thermal resistance to heat flow from the skin surface to the environment. The temperature at the interface of the measurement device and the skin surface is sensed by a micro thermocouple or thermistor. The multidimensional bioheat equation was solved numerically to obtain the temperature field both in the tissue beneath the device and in the device proper. Parametric variations were made of the thermal conductivity of the foam pad and of the blood perfusion rate. Of these, the former was found to have the greater effect on the results. In the limiting case where the thermal conductivity of the foam pad is zero, an error of 1.5 °C in the measured temperature was identified. For foam pad conductivities of 0.03 and 0.06 W/m-°C, the numerical solutions gave temperature measurement errors of 0.5 and 0.15 °C, respectively.
AB - Numerical simulation is used to investigate the accuracy of a widely used direct-contact device for measuring skin-surface temperature. The device incorporates a foam pad which functions as a de facto thermal resistance to heat flow from the skin surface to the environment. The temperature at the interface of the measurement device and the skin surface is sensed by a micro thermocouple or thermistor. The multidimensional bioheat equation was solved numerically to obtain the temperature field both in the tissue beneath the device and in the device proper. Parametric variations were made of the thermal conductivity of the foam pad and of the blood perfusion rate. Of these, the former was found to have the greater effect on the results. In the limiting case where the thermal conductivity of the foam pad is zero, an error of 1.5 °C in the measured temperature was identified. For foam pad conductivities of 0.03 and 0.06 W/m-°C, the numerical solutions gave temperature measurement errors of 0.5 and 0.15 °C, respectively.
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M3 - Conference contribution
AN - SCOPUS:70349144561
SN - 9780791848487
T3 - 2008 Proceedings of the ASME Summer Heat Transfer Conference, HT 2008
SP - 341
EP - 346
BT - 2008 Proceedings of the ASME Summer Heat Transfer Conference, HT 2008
T2 - 2008 ASME Summer Heat Transfer Conference, HT 2008
Y2 - 10 August 2008 through 14 August 2008
ER -