Errors in skin temperature measurements

M. V. Dugay, Ephraim M Sparrow, S. K.S. Boetcher

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Scopus citations

Abstract

Numerical simulation is used to investigate the accuracy of a widely used direct-contact device for measuring skin-surface temperature. The device incorporates a foam pad which functions as a de facto thermal resistance to heat flow from the skin surface to the environment. The temperature at the interface of the measurement device and the skin surface is sensed by a micro thermocouple or thermistor. The multidimensional bioheat equation was solved numerically to obtain the temperature field both in the tissue beneath the device and in the device proper. Parametric variations were made of the thermal conductivity of the foam pad and of the blood perfusion rate. Of these, the former was found to have the greater effect on the results. In the limiting case where the thermal conductivity of the foam pad is zero, an error of 1.5 °C in the measured temperature was identified. For foam pad conductivities of 0.03 and 0.06 W/m-°C, the numerical solutions gave temperature measurement errors of 0.5 and 0.15 °C, respectively.

Original languageEnglish (US)
Title of host publication2008 Proceedings of the ASME Summer Heat Transfer Conference, HT 2008
Pages341-346
Number of pages6
StatePublished - Sep 21 2009
Event2008 ASME Summer Heat Transfer Conference, HT 2008 - Jacksonville, FL, United States
Duration: Aug 10 2008Aug 14 2008

Publication series

Name2008 Proceedings of the ASME Summer Heat Transfer Conference, HT 2008
Volume3

Other

Other2008 ASME Summer Heat Transfer Conference, HT 2008
CountryUnited States
CityJacksonville, FL
Period8/10/088/14/08

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