Environmental effects on Cu/SiO2 and Cu/Ti/SiO2 thin film adhesion

  • N. I. Tymiak
  • , M. Li
  • , A. A. Volinsky
  • , Y. Katz
  • , William W Gerberich

Research output: Contribution to journal › Conference article › peer-review

3 Scopus citations

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Keyphrases

Engineering

Material Science