Electron and hole mobility enhancement in strained SOI by wafer bonding

  • Lijuan Huang
  • , Jack O. Chu
  • , S. A. Goma
  • , C. P. D'Emic
  • , Steven J. Koester
  • , Donald F. Canaperi
  • , Patricia M. Mooney
  • , S. A. Cordes
  • , James L. Speidell
  • , R. M. Anderson
  • , H. S.Philip Wong

Research output: Contribution to journal › Article › peer-review

62 Scopus citations

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Engineering