Electromigration-aware interconnect design

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Electromigration (EM) is seen as a growing problem in recent and upcoming technology nodes, and affects a wider variety of wires (e.g., power grid, clock/signal nets), circuits (e.g., digital, analog, mixed-signal), and systems (e.g., mobile, server, automotive), touching lower levels of metal than before. Moreover, unlike traditional EM checks that were performed on each wire individually, EM checks must evolve to consider the system-level impact of wire failure. This requires a change in how interconnect design incorporates this effect. This paper overviews the root causes of EM, its impact on high-performance designs, and techniques for analyzing, working around, and alleviating the effects of EM.

Original languageEnglish (US)
Title of host publicationISPD 2019 - Proceedings of the 2019 International Symposium on Physical Design
PublisherAssociation for Computing Machinery
Pages83-90
Number of pages8
ISBN (Electronic)9781450362535
DOIs
StatePublished - Apr 4 2019
Event2019 ACM International Symposium on Physical Design, ISPD 2019 - San Francisco, United States
Duration: Apr 14 2019Apr 17 2019

Publication series

NameProceedings of the International Symposium on Physical Design

Conference

Conference2019 ACM International Symposium on Physical Design, ISPD 2019
CountryUnited States
CitySan Francisco
Period4/14/194/17/19

Fingerprint

Electromigration
Wire
Digital circuits
Clocks
Servers
Metals

Keywords

  • Clock networks
  • Electromigration
  • Power grids
  • Reliability
  • Stress

Cite this

Sapatnekar, S. S. (2019). Electromigration-aware interconnect design. In ISPD 2019 - Proceedings of the 2019 International Symposium on Physical Design (pp. 83-90). (Proceedings of the International Symposium on Physical Design). Association for Computing Machinery. https://doi.org/10.1145/3299902.3313156

Electromigration-aware interconnect design. / Sapatnekar, Sachin S.

ISPD 2019 - Proceedings of the 2019 International Symposium on Physical Design. Association for Computing Machinery, 2019. p. 83-90 (Proceedings of the International Symposium on Physical Design).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Sapatnekar, SS 2019, Electromigration-aware interconnect design. in ISPD 2019 - Proceedings of the 2019 International Symposium on Physical Design. Proceedings of the International Symposium on Physical Design, Association for Computing Machinery, pp. 83-90, 2019 ACM International Symposium on Physical Design, ISPD 2019, San Francisco, United States, 4/14/19. https://doi.org/10.1145/3299902.3313156
Sapatnekar SS. Electromigration-aware interconnect design. In ISPD 2019 - Proceedings of the 2019 International Symposium on Physical Design. Association for Computing Machinery. 2019. p. 83-90. (Proceedings of the International Symposium on Physical Design). https://doi.org/10.1145/3299902.3313156
Sapatnekar, Sachin S. / Electromigration-aware interconnect design. ISPD 2019 - Proceedings of the 2019 International Symposium on Physical Design. Association for Computing Machinery, 2019. pp. 83-90 (Proceedings of the International Symposium on Physical Design).
@inproceedings{d1d70bd48d734ae69c95060058ab7c7f,
title = "Electromigration-aware interconnect design",
abstract = "Electromigration (EM) is seen as a growing problem in recent and upcoming technology nodes, and affects a wider variety of wires (e.g., power grid, clock/signal nets), circuits (e.g., digital, analog, mixed-signal), and systems (e.g., mobile, server, automotive), touching lower levels of metal than before. Moreover, unlike traditional EM checks that were performed on each wire individually, EM checks must evolve to consider the system-level impact of wire failure. This requires a change in how interconnect design incorporates this effect. This paper overviews the root causes of EM, its impact on high-performance designs, and techniques for analyzing, working around, and alleviating the effects of EM.",
keywords = "Clock networks, Electromigration, Power grids, Reliability, Stress",
author = "Sapatnekar, {Sachin S.}",
year = "2019",
month = "4",
day = "4",
doi = "10.1145/3299902.3313156",
language = "English (US)",
series = "Proceedings of the International Symposium on Physical Design",
publisher = "Association for Computing Machinery",
pages = "83--90",
booktitle = "ISPD 2019 - Proceedings of the 2019 International Symposium on Physical Design",

}

TY - GEN

T1 - Electromigration-aware interconnect design

AU - Sapatnekar, Sachin S.

PY - 2019/4/4

Y1 - 2019/4/4

N2 - Electromigration (EM) is seen as a growing problem in recent and upcoming technology nodes, and affects a wider variety of wires (e.g., power grid, clock/signal nets), circuits (e.g., digital, analog, mixed-signal), and systems (e.g., mobile, server, automotive), touching lower levels of metal than before. Moreover, unlike traditional EM checks that were performed on each wire individually, EM checks must evolve to consider the system-level impact of wire failure. This requires a change in how interconnect design incorporates this effect. This paper overviews the root causes of EM, its impact on high-performance designs, and techniques for analyzing, working around, and alleviating the effects of EM.

AB - Electromigration (EM) is seen as a growing problem in recent and upcoming technology nodes, and affects a wider variety of wires (e.g., power grid, clock/signal nets), circuits (e.g., digital, analog, mixed-signal), and systems (e.g., mobile, server, automotive), touching lower levels of metal than before. Moreover, unlike traditional EM checks that were performed on each wire individually, EM checks must evolve to consider the system-level impact of wire failure. This requires a change in how interconnect design incorporates this effect. This paper overviews the root causes of EM, its impact on high-performance designs, and techniques for analyzing, working around, and alleviating the effects of EM.

KW - Clock networks

KW - Electromigration

KW - Power grids

KW - Reliability

KW - Stress

UR - http://www.scopus.com/inward/record.url?scp=85064686882&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85064686882&partnerID=8YFLogxK

U2 - 10.1145/3299902.3313156

DO - 10.1145/3299902.3313156

M3 - Conference contribution

AN - SCOPUS:85064686882

T3 - Proceedings of the International Symposium on Physical Design

SP - 83

EP - 90

BT - ISPD 2019 - Proceedings of the 2019 International Symposium on Physical Design

PB - Association for Computing Machinery

ER -