Electromigration Assessment in Power Grids with Account of Redundancy and Non-Uniform Temperature Distribution

Armen Kteyan, Valeriy Sukharev, Alexander Volkov, Jun Ho Choy, Farid N. Najm, Yong Hyeon Yi, Chris H. Kim, Stephane Moreau

Research output: Chapter in Book/Report/Conference proceedingConference contribution


A recently proposed methodology for electromigration (EM) assessment in on-chip power/ground grid of integrated circuits has been validated by means of measurements, performed on dedicated test grids. IR drop degradation in the grid is used for defining the EM failure criteria. Physics-based models are involved for simulation of EM-induced stress evolution in interconnect structures, void formation and evolution, resistance increase of the voided segments, and consequent re-distribution of electric current in the redundant grid paths. A grid-like test structure, fabricated with a 65 nm technology and consisting of two metal layers, allowed to calibrate the voiding models by tracking voltage evolution in all grid nodes in experiment and in simulation. Good fit of the measured and simulated time-To-failure (TTF) probability distribution was obtained in both cases of uniform and non-uniform temperature distribution across the grid. The second test grid was fabricated with a 28 nm technology, consisted of 4 metal layers, and contained power and ground nets connected to "quasi-cells"with poly-resistors, which were specially designed for operating at elevated temperatures ∼350°C. The existing current distributions resulted in different behavior of EM-induced failures in these nets: A gradual voltage evolution in power net, and sharp changes in ground net were observed in experiment, and successfully reproduced in simulations.

Original languageEnglish (US)
Title of host publicationISPD 2023 - Proceedings of the 2023 International Symposium on Physical Design
PublisherAssociation for Computing Machinery
Number of pages9
ISBN (Electronic)9781450399784
StatePublished - Mar 26 2023
Event32nd ACM International Symposium on Physical Design, ISPD 2023 - Virtual, Online, United States
Duration: Mar 26 2023Mar 29 2023

Publication series

NameProceedings of the International Symposium on Physical Design


Conference32nd ACM International Symposium on Physical Design, ISPD 2023
Country/TerritoryUnited States
CityVirtual, Online

Bibliographical note

Funding Information:
This work was supported in part by the French National Research Agency (ANR) under the “Investissements d’avenir” programs: ANR 10-AIRT-0005 (IRT NANO-ELEC) (S. Moreau) and in part by Semiconductor Research Corporation (Y. Yi and C.H. Kim).

Publisher Copyright:
© 2023 Owner/Author.


  • Failure analysis
  • Power grids
  • Reliability theory
  • Stress


Dive into the research topics of 'Electromigration Assessment in Power Grids with Account of Redundancy and Non-Uniform Temperature Distribution'. Together they form a unique fingerprint.

Cite this