Keyphrases
Micro-electro-mechanical Systems
100%
Galfenol
100%
Magnetostrictive
100%
Electrodeposition
100%
FeGa
100%
Delamination
40%
Capacitance Bridge
40%
Magnetostriction Measurements
40%
Thick Film
20%
Silicon Oxide
20%
Magnetostriction
20%
Glass Substrate
20%
Microelectromechanical Devices
20%
Glass Samples
20%
Electrodeposit
20%
Rotating Disk Electrode
20%
Adhesion Layer
20%
Bridge Measurements
20%
Uniform Boundary Condition
20%
Robust Adhesion
20%
Adhesion to Substrate
20%
Bridging Technique
20%
Material Science
Microelectromechanical System
100%
Electrostriction
100%
Electrodeposition
100%
Thin Films
100%
Capacitance
66%
Film
66%
Delamination
66%
Silicon
33%
Rotating Disc Electrode
33%
Oxide Compound
33%
Thick Films
33%
Engineering
Microelectromechanical System
100%
Thin Films
100%
Delamination
66%
Glass Substrate
33%
Rotating Disc Electrode
33%
Adhesion Layer
33%
Boundary Condition
33%
Silicon Oxide
33%