Electrocaloric Performance of Multilayer Ceramic Chips: Effect of Geometric Structure Induced Internal Stress

Keyphrases

• Geometric Structure 100%
• Internal Stress 100%
• Electrocaloric 100%
• Multilayer Ceramics 100%
• Ceramic chip 100%
• Multilayer Ceramic Capacitor 83%
• Breakdown Strength 33%
• Elastocaloric Cooling 33%
• Clamping Stress 33%
• Electrocaloric Materials 33%
• Layer Thickness 16%
• Cooling Technology 16%
• Environmentally Benign 16%
• Stress Distribution 16%
• Large Strain 16%
• Active Area 16%
• Cooling System 16%
• Volume Ratio 16%
• Breakdown Field 16%
• Thermal Expansion Mismatch 16%
• Heat Flow 16%
• Volume Percentage 16%
• Densification 16%
• High Electric Field 16%
• Residual Thermal Stress 16%
• Geometric Parameters 16%
• Finite Element Modeling 16%
• Active Layer 16%
• Optimum Structure 16%
• Electric Properties 16%
• Active Volume 16%
• Inactive Volume 16%
• Low Driving Voltage 16%
• PMN-PT 16%
• Solid-state Cooling 16%
• Sintering Stress 16%
• Inactive Layer 16%
• Breakdown Enhancement 16%
• Cooling Elements 16%

Engineering

• Internal Stress 100%
• Active Area 33%
• Layer Thickness 33%
• High Electric Field 33%
• Geometric Parameter 33%
• Past Decade 33%
• Volume Ratio 33%
• Voltage Driving 33%
• Breakdown Field 33%
• Granulocyte 33%
• Residual Thermal Stress 33%
• Cooling System 33%
• Active Layer 33%
• Densification 33%
• Sintering 33%
• Fem Model 33%

Material Science

• Capacitor 100%
• Thermal Expansion 20%
• Finite Element Modeling 20%
• Thermal Stress 20%
• Sintering 20%