Efficient Thermal Placement of Standard Cells in 3D ICs using a Force Directed Approach

Brent Goplen, Sachin Sapatnekar

Research output: Chapter in Book/Report/Conference proceedingConference contribution

207 Scopus citations

Abstract

As the technology node progresses, thermal problems are becoming more prominent especially in the developing technology of three-dimensional (3D) integrated circuits. The thermal placement method presented in this paper uses an iterative force-directed approach in which thermal forces direct cells away from areas of high temperature. Finite element analysis (FEA) is used to calculate temperatures efficiently during each iteration. Benchmark circuits produce thermal placements with both lower temperatures and thermal gradients while wirelength is minimally affected.

Original languageEnglish (US)
Title of host publicationIEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers
Pages86-89
Number of pages4
StatePublished - 2003
EventIEEE/ACM International Conference on Computer Aided Design ICCAD 2003: IEEE/ACM Digest of Technical Papers - San Jose, CA, United States
Duration: Nov 9 2003Nov 13 2003

Other

OtherIEEE/ACM International Conference on Computer Aided Design ICCAD 2003: IEEE/ACM Digest of Technical Papers
CountryUnited States
CitySan Jose, CA
Period11/9/0311/13/03

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