Abstract
Determining aging and End of Lifetime (EOL) for VLSI circuits can be a slow and cumbersome process. A simple extrapolation of aging results, under statistical variations and other uncertainties, may cause large errors in EOL prediction and over-margining. This work provides a fast and effective simulation solution to determine guard band against aging in a design. In this paper, we present an improved version of System Reliability Analyzer (SyRA), SyRA-X, to provide: (1) circuit aging calculation which is reliable under various switching activities at each node, (2) device, gate, and path level analysis of aging with dynamic inputs, and (3) verification of SyRA-X with a minimum guard band to give prediction over 99% accuracy.
Original language | English (US) |
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Title of host publication | 2017 International Reliability Physics Symposium, IRPS 2017 |
Publisher | Institute of Electrical and Electronics Engineers Inc. |
Pages | CR5.1-CR5.4 |
ISBN (Electronic) | 9781509066407 |
DOIs | |
State | Published - May 30 2017 |
Externally published | Yes |
Event | 2017 International Reliability Physics Symposium, IRPS 2017 - Monterey, United States Duration: Apr 2 2017 → Apr 6 2017 |
Publication series
Name | IEEE International Reliability Physics Symposium Proceedings |
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ISSN (Print) | 1541-7026 |
Other
Other | 2017 International Reliability Physics Symposium, IRPS 2017 |
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Country/Territory | United States |
City | Monterey |
Period | 4/2/17 → 4/6/17 |
Bibliographical note
Publisher Copyright:© 2017 IEEE.
Keywords
- Aging
- Bias temperature instability
- Circuit simulation
- VLSI reliability