Effects of solvent evaporation time on immediate adhesive properties of universal adhesives to dentin

Issis V. Luque-Martinez, Jorge Perdigão, Miguel A. M͡noz, Ana Sezinando, Alessandra Reis, Alessandro D. Loguercio

Research output: Contribution to journalArticle

49 Citations (Scopus)

Abstract

Objective. To evaluate the microtensile bond strengths (μTBS) and nanoleakage (NL) of three universal or multi-mode adhesives, applied with increasing solvent evaporation times. Methods. One-hundred and forty caries-free extracted third molars were divided into 20 groups for bond strength testing, according to three factors: (1) Adhesive - All-Bond Universal (ABU, Bisco, Inc.), Prime&Bond Elect (PBE, Dentsply), and Scotchbond Universal Adhesive (SBU, 3 M ESPE); (2) Bonding strategy - self-etch (SE) or etch-and-rinse (ER); and (3) Adhesive solvent evaporation time - 5 s, 15 s, and 25 s. Two extra groups were prepared with ABU because the respective manufacturer recommends a solvent evaporation time of 10 s. After restorations were constructed, specimens were stored in water (37°C/24 h). Resin-dentin beams (0.8 mm2) were tested at 0.5 mm/min (μTBS). For NL, forty extracted molars were randomly assigned to each of the 20 groups. Dentin disks were restored, immersed in ammoniacal silver nitrate, sectioned and processed for evaluation under a FESEM in backscattered mode. Data from μTBS were analyzed using two-way ANOVA (adhesive vs. drying time) for each strategy, and Tukey's test (α = 0.05). NL data were computed with non-parametric tests (Kruskal-Wallis and Mann-Whitney tests, α = 0.05). Results. Increasing solvent evaporation time from 5 s to 25 s resulted in statistically higher mean μTBS for all adhesives when used in ER mode. Regarding NL, ER resulted in greater NL than SE for each of the evaporation times regardless of the adhesive used. A solvent evaporation time of 25 s resulted in the lowest NL for SBU-ER. Significance. Residual water and/or solvent may compromise the performance of universal adhesives, which may be improved with extended evaporation times.

Original languageEnglish (US)
Pages (from-to)1126-1135
Number of pages10
JournalDental Materials
Volume30
Issue number10
DOIs
StatePublished - Jan 1 2014

Fingerprint

Dentin
Adhesives
Evaporation
Silver Nitrate
Water
Third Molar
Analysis of variance (ANOVA)
Restoration
Nitrates
Drying
Silver
Resins
Analysis of Variance
Testing

Keywords

  • Etch-and-rinse
  • Microtensile bond strength
  • Nanoleakage
  • Self-etch
  • Universal simplified adhesive systems solvent evaporation Dentin

Cite this

Effects of solvent evaporation time on immediate adhesive properties of universal adhesives to dentin. / Luque-Martinez, Issis V.; Perdigão, Jorge; M͡noz, Miguel A.; Sezinando, Ana; Reis, Alessandra; Loguercio, Alessandro D.

In: Dental Materials, Vol. 30, No. 10, 01.01.2014, p. 1126-1135.

Research output: Contribution to journalArticle

Luque-Martinez, Issis V. ; Perdigão, Jorge ; M͡noz, Miguel A. ; Sezinando, Ana ; Reis, Alessandra ; Loguercio, Alessandro D. / Effects of solvent evaporation time on immediate adhesive properties of universal adhesives to dentin. In: Dental Materials. 2014 ; Vol. 30, No. 10. pp. 1126-1135.
@article{941b40403f114eac9aeda3055e16f4b0,
title = "Effects of solvent evaporation time on immediate adhesive properties of universal adhesives to dentin",
abstract = "Objective. To evaluate the microtensile bond strengths (μTBS) and nanoleakage (NL) of three universal or multi-mode adhesives, applied with increasing solvent evaporation times. Methods. One-hundred and forty caries-free extracted third molars were divided into 20 groups for bond strength testing, according to three factors: (1) Adhesive - All-Bond Universal (ABU, Bisco, Inc.), Prime&Bond Elect (PBE, Dentsply), and Scotchbond Universal Adhesive (SBU, 3 M ESPE); (2) Bonding strategy - self-etch (SE) or etch-and-rinse (ER); and (3) Adhesive solvent evaporation time - 5 s, 15 s, and 25 s. Two extra groups were prepared with ABU because the respective manufacturer recommends a solvent evaporation time of 10 s. After restorations were constructed, specimens were stored in water (37°C/24 h). Resin-dentin beams (0.8 mm2) were tested at 0.5 mm/min (μTBS). For NL, forty extracted molars were randomly assigned to each of the 20 groups. Dentin disks were restored, immersed in ammoniacal silver nitrate, sectioned and processed for evaluation under a FESEM in backscattered mode. Data from μTBS were analyzed using two-way ANOVA (adhesive vs. drying time) for each strategy, and Tukey's test (α = 0.05). NL data were computed with non-parametric tests (Kruskal-Wallis and Mann-Whitney tests, α = 0.05). Results. Increasing solvent evaporation time from 5 s to 25 s resulted in statistically higher mean μTBS for all adhesives when used in ER mode. Regarding NL, ER resulted in greater NL than SE for each of the evaporation times regardless of the adhesive used. A solvent evaporation time of 25 s resulted in the lowest NL for SBU-ER. Significance. Residual water and/or solvent may compromise the performance of universal adhesives, which may be improved with extended evaporation times.",
keywords = "Etch-and-rinse, Microtensile bond strength, Nanoleakage, Self-etch, Universal simplified adhesive systems solvent evaporation Dentin",
author = "Luque-Martinez, {Issis V.} and Jorge Perdig{\~a}o and M͡noz, {Miguel A.} and Ana Sezinando and Alessandra Reis and Loguercio, {Alessandro D.}",
year = "2014",
month = "1",
day = "1",
doi = "10.1016/j.dental.2014.07.002",
language = "English (US)",
volume = "30",
pages = "1126--1135",
journal = "Dental Materials",
issn = "0109-5641",
publisher = "Elsevier Science",
number = "10",

}

TY - JOUR

T1 - Effects of solvent evaporation time on immediate adhesive properties of universal adhesives to dentin

AU - Luque-Martinez, Issis V.

AU - Perdigão, Jorge

AU - M͡noz, Miguel A.

AU - Sezinando, Ana

AU - Reis, Alessandra

AU - Loguercio, Alessandro D.

PY - 2014/1/1

Y1 - 2014/1/1

N2 - Objective. To evaluate the microtensile bond strengths (μTBS) and nanoleakage (NL) of three universal or multi-mode adhesives, applied with increasing solvent evaporation times. Methods. One-hundred and forty caries-free extracted third molars were divided into 20 groups for bond strength testing, according to three factors: (1) Adhesive - All-Bond Universal (ABU, Bisco, Inc.), Prime&Bond Elect (PBE, Dentsply), and Scotchbond Universal Adhesive (SBU, 3 M ESPE); (2) Bonding strategy - self-etch (SE) or etch-and-rinse (ER); and (3) Adhesive solvent evaporation time - 5 s, 15 s, and 25 s. Two extra groups were prepared with ABU because the respective manufacturer recommends a solvent evaporation time of 10 s. After restorations were constructed, specimens were stored in water (37°C/24 h). Resin-dentin beams (0.8 mm2) were tested at 0.5 mm/min (μTBS). For NL, forty extracted molars were randomly assigned to each of the 20 groups. Dentin disks were restored, immersed in ammoniacal silver nitrate, sectioned and processed for evaluation under a FESEM in backscattered mode. Data from μTBS were analyzed using two-way ANOVA (adhesive vs. drying time) for each strategy, and Tukey's test (α = 0.05). NL data were computed with non-parametric tests (Kruskal-Wallis and Mann-Whitney tests, α = 0.05). Results. Increasing solvent evaporation time from 5 s to 25 s resulted in statistically higher mean μTBS for all adhesives when used in ER mode. Regarding NL, ER resulted in greater NL than SE for each of the evaporation times regardless of the adhesive used. A solvent evaporation time of 25 s resulted in the lowest NL for SBU-ER. Significance. Residual water and/or solvent may compromise the performance of universal adhesives, which may be improved with extended evaporation times.

AB - Objective. To evaluate the microtensile bond strengths (μTBS) and nanoleakage (NL) of three universal or multi-mode adhesives, applied with increasing solvent evaporation times. Methods. One-hundred and forty caries-free extracted third molars were divided into 20 groups for bond strength testing, according to three factors: (1) Adhesive - All-Bond Universal (ABU, Bisco, Inc.), Prime&Bond Elect (PBE, Dentsply), and Scotchbond Universal Adhesive (SBU, 3 M ESPE); (2) Bonding strategy - self-etch (SE) or etch-and-rinse (ER); and (3) Adhesive solvent evaporation time - 5 s, 15 s, and 25 s. Two extra groups were prepared with ABU because the respective manufacturer recommends a solvent evaporation time of 10 s. After restorations were constructed, specimens were stored in water (37°C/24 h). Resin-dentin beams (0.8 mm2) were tested at 0.5 mm/min (μTBS). For NL, forty extracted molars were randomly assigned to each of the 20 groups. Dentin disks were restored, immersed in ammoniacal silver nitrate, sectioned and processed for evaluation under a FESEM in backscattered mode. Data from μTBS were analyzed using two-way ANOVA (adhesive vs. drying time) for each strategy, and Tukey's test (α = 0.05). NL data were computed with non-parametric tests (Kruskal-Wallis and Mann-Whitney tests, α = 0.05). Results. Increasing solvent evaporation time from 5 s to 25 s resulted in statistically higher mean μTBS for all adhesives when used in ER mode. Regarding NL, ER resulted in greater NL than SE for each of the evaporation times regardless of the adhesive used. A solvent evaporation time of 25 s resulted in the lowest NL for SBU-ER. Significance. Residual water and/or solvent may compromise the performance of universal adhesives, which may be improved with extended evaporation times.

KW - Etch-and-rinse

KW - Microtensile bond strength

KW - Nanoleakage

KW - Self-etch

KW - Universal simplified adhesive systems solvent evaporation Dentin

UR - http://www.scopus.com/inward/record.url?scp=84922337985&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84922337985&partnerID=8YFLogxK

U2 - 10.1016/j.dental.2014.07.002

DO - 10.1016/j.dental.2014.07.002

M3 - Article

VL - 30

SP - 1126

EP - 1135

JO - Dental Materials

JF - Dental Materials

SN - 0109-5641

IS - 10

ER -