Effects of plasma etching on orientation ratio for longitudinal recording media

L. Huang, J. P. Wang

Research output: Contribution to journalArticlepeer-review

4 Scopus citations

Abstract

Studies on the effects of rf plasma etching treatment on textured NiP/Al substrate on the properties of CoCrTaPt/CrMo longitudinal recording media were carried out. The dependence of coercivity (H c), coercivity orientation ratio (OR), and disk surface roughness (R a) on etching parameters, i.e., etching time, pressure, and power, were presented. It was found that by optimizing the etching process parameters, an increase of H c and OR and a decrease of R a could be achieved. It was observed that good preferred orientation is necessary for obtaining high OR. The increase of OR could be attributed to the cleaning effect or surface modification by the rf plasma etching treatment on the textured substrate.

Original languageEnglish (US)
Pages (from-to)8626-8628
Number of pages3
JournalJournal of Applied Physics
Volume91
Issue number10 I
DOIs
StatePublished - May 15 2002

Fingerprint Dive into the research topics of 'Effects of plasma etching on orientation ratio for longitudinal recording media'. Together they form a unique fingerprint.

Cite this