Keyphrases
Surface Modification
100%
Atmospheric Pressure
100%
Plasma Processing
100%
Plasma Jet
100%
Polymer Surface
100%
H2O Plasma
100%
Water Vapor Effect
100%
Polymer Etching
100%
Etching Rate
80%
OH Radical
60%
Treatment Distance
60%
Gas Phase
40%
Laser-induced Fluorescence
20%
Elemental Composition
20%
Effluent
20%
Controlled Experiment
20%
Polystyrene
20%
Substrate Temperature
20%
Etching Process
20%
Dominant Role
20%
H Atoms
20%
Etched Surface
20%
Substrate Surface
20%
Density Change
20%
O2 Plasma
20%
Surface Enhancement
20%
Gas Adsorption
20%
Surface Adsorption
20%
High Etch Rate
20%
RF Plasma Jet
20%
Ar-H2 Plasmas
20%
Plasma Power
20%
Intermediate Care
20%
Power Concentration
20%
Etching Reaction
20%
Gaseous Environment
20%
Reaction Coefficient
20%
Etching Efficiency
20%
Exponential Decrease
20%
Ar/O2 Plasma
20%
Engineering
Etch Rate
100%
Plasma Applications
100%
Atmospheric Pressure
100%
Gas-Phase
40%
Model System
20%
Substrate Surface
20%
Substrate Temperature
20%
Elemental Composition
20%
Etching Process
20%
Target Material
20%
Polymer Surface
20%
Control Experiment
20%
Change of Density
20%
Radio Frequency
20%
Adsorption of Gases
20%
Material Science
Density
100%
Surface Treatment
100%
Water Vapor
100%
Polystyrene
50%
Laser Induced Fluorescence
50%